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Cabeçalhos, pinos machos
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo de conector | Tipo de contato | Passo - Acoplamento | Número de posições | Número de Linhas | Espaçamento de Linha - Acoplamento | Número de posições carregadas | Estilo | Cobertura | Tipo de montagem | Terminação | Fixação Tipo | Comprimento do Contato - Acoplamento | Comprimento do Contato - Poste | Comprimento Geral do Contato | Altura do Isolamento | Formato do Contato | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Acabamento de Contato - Poste | Material de Contato | Material de Isolamento | Recursos | Temperatura operacional | Classificação de Corrente (Amps) |
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SLY 3 041 10 G0.5 MM, ANGLED |
0 |
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Ficha técnica |
SLY 3 041 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 12 S0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 2 139 32 Z0.5 MM, STRAIGHT |
0 |
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Ficha técnica |
SLY 2 139 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 32 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.370" (9.40mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 1 098 39 S0.5 MM, STRAIGHT |
0 |
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Ficha técnica |
SLY 1 098 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 39 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.209" (5.30mm) | 0.118" (3.00mm) | 0.386" (9.80mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 25 Z B SM0.5 MM |
0 |
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Ficha técnica |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 10 SMD 040 20 G B SM0.5 MM |
0 |
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Ficha técnica |
SLY 10 SMD 040 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 20 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.268" (6.80mm) | - | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 26 G B SM0.5 MM |
0 |
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Ficha técnica |
SLY 9 SMD 040 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 2 085 14 S0.5 MM, STRAIGHT |
0 |
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Ficha técnica |
SLY 2 085 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 14 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.157" (4.00mm) | 0.118" (3.00mm) | 0.335" (8.50mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 36 S0.5 MM |
0 |
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Ficha técnica |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 24 G0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 44 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 44 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 42 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 42 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 3 082 23 Z0.5 MM, ANGLED |
0 |
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Ficha técnica |
SLY 3 082 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 23 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.323" (8.20mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 092 14 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 14 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 3 041 37 Z0.5 MM, ANGLED |
0 |
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Ficha técnica |
SLY 3 041 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 37 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 28 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 4 041 24 G0.5 MM, ANGLED |
0 |
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Ficha técnica |
SLY 4 041 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 24 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 60 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 4 041 20 G0.5 MM, ANGLED |
0 |
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Ficha técnica |
SLY 4 041 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 20 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 092 8 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 8 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
