Disponível 24/7 em
+86 13632816717
Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
100-PRS10001-12CONN SOCKET PGA ZIF GOLD |
0 |
|
Ficha técnica |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
40-6556-40CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
514-83-420M26-001148CONN SOCKET BGA 420POS GOLD |
0 |
|
Ficha técnica |
514 | Bulk | Active | BGA | 420 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-381-18-101135PGA SOLDER TAIL |
0 |
|
Ficha técnica |
550 | Bulk | Active | PGA | 381 (18 x 18) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0520-T-18.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
Ficha técnica |
HLS | Bulk | Active | SIP | 100 (5 x 20) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
614-83-320-19-131144CONN SOCKET PGA 320POS GOLD |
0 |
|
Ficha técnica |
614 | Bulk | Active | PGA | 320 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-352M26-001104BGA SURFACE MOUNT 1.27MM |
0 |
|
Ficha técnica |
558 | Bulk | Active | BGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
132-PGM13038-50CONN SOCKET PGA GOLD |
0 |
|
- |
PGM | - | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
614-83-321-19-121144CONN SOCKET PGA 321POS GOLD |
0 |
|
Ficha técnica |
614 | Bulk | Active | PGA | 321 (21 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-352M26-001105CONN SOCKET PGA 352POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
110-33-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
44-536-11CONN SOCKET PLCC ZIF 44POS GOLD |
0 |
|
- |
536 | - | Obsolete | PLCC, ZIF (ZIP) | 44 (4 x 11) | 0.050" (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |
|
|
32-3574-16CONN IC DIP SOCKET ZIF 32POS |
0 |
|
Ficha técnica |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
558-10-356M26-001104BGA SURFACE MOUNT 1.27MM |
0 |
|
Ficha técnica |
558 | Bulk | Active | BGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-400M20-000152BGA SOLDER TAIL |
0 |
|
Ficha técnica |
550 | Bulk | Active | BGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-463-19-101147CONN SOCKET PGA 463POS GOLD |
0 |
|
Ficha técnica |
546 | Bulk | Active | PGA | 463 (19 x 19) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-357M19-001104BGA SURFACE MOUNT 1.27MM |
0 |
|
Ficha técnica |
558 | Bulk | Active | BGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-576M30-001166BGA PIN ADAPTER 1.27MM SMD |
0 |
|
Ficha técnica |
550 | Bulk | Active | BGA | 576 (30 x 30) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-356M26-001105CONN SOCKET PGA 356POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
