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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
47-PRS16021-12

47-PRS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
47-PRS16021-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
76-PLS19033-12

76-PLS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
76-PLS19033-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
76-PRS19033-12

76-PRS19033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
76-PRS19033-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PLS13013-12

121-PLS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PLS13013-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PLS13106-12

121-PLS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PLS13106-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PRS13013-12

121-PRS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PRS13013-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PRS13106-12

121-PRS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PRS13106-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
510-13-400-20-000001

510-13-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-13-400-20-000001

Ficha técnica

510 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-PLS13009-12

124-PLS13009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
124-PLS13009-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
124-PRS13009-12

124-PRS13009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
124-PRS13009-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
112-PRS21028-12

112-PRS21028-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
112-PRS21028-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PLS12001-12

144-PLS12001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
144-PLS12001-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PRS12001-12

144-PRS12001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
144-PRS12001-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
558-10-560M33-001101

558-10-560M33-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-560M33-001101

Ficha técnica

558 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
163-PLS15064-12

163-PLS15064-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
163-PLS15064-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
163-PLS15065-12

163-PLS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
163-PLS15065-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
163-PRS15064-12

163-PRS15064-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
163-PRS15064-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
128-PLS12023-12

128-PLS12023-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
128-PLS12023-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
128-PLS13078-12

128-PLS13078-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
128-PLS13078-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
128-PRS13078-12

128-PRS13078-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
128-PRS13078-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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