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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
121-PLS13121-12

121-PLS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PLS13121-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
121-PRS13121-12

121-PRS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
121-PRS13121-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
80-PRS21027-12

80-PRS21027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
80-PRS21027-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
558-10-576M30-001104

558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-576M30-001104

Ficha técnica

558 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
132-PLS14016-12

132-PLS14016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
132-PLS14016-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-576M30-001105

518-77-576M30-001105

CONN SOCKET PGA 576POS GOLD

Preci-Dip

0
RFQ
518-77-576M30-001105

Ficha técnica

518 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
1017-2-0256-0B-01

1017-2-0256-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

0
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
550-10-652M35-001152

550-10-652M35-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-652M35-001152

Ficha técnica

550 Bulk Active BGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
200-6321-9UN-1900

200-6321-9UN-1900

CONN SOCKET PGA ZIF 441POS GOLD

3M

1
RFQ
200-6321-9UN-1900

Ficha técnica

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 441 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
100-PLS17048-12

100-PLS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
100-PLS17048-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
100-PLS17049-12

100-PLS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
100-PLS17049-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
100-PRS17048-12

100-PRS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
100-PRS17048-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
100-PRS17049-12

100-PRS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
100-PRS17049-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
235-3019-02-0602

235-3019-02-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

0
RFQ
235-3019-02-0602

Ficha técnica

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
24-3575-18

24-3575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3575-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6575-18

24-6575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6575-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
518-77-576M30-001106

518-77-576M30-001106

CONN SOCKET PGA 576POS GOLD

Preci-Dip

0
RFQ
518-77-576M30-001106

Ficha técnica

518 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
144-PLS15026-12

144-PLS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
144-PLS15026-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
144-PRS15026-12

144-PRS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
144-PRS15026-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
145-PRS15058-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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