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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
145-PRS15062-12

145-PRS15062-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
145-PRS15062-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PLS15024-12

145-PLS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
145-PLS15024-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15024-12

145-PRS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
145-PRS15024-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
132-PRS14033-12

132-PRS14033-12

PGA ZIF TEST/BURN-IN SOCKET

Aries Electronics

0
RFQ

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
268-6311-9UA-1902 GRID ZIP (11X11)

268-6311-9UA-1902 GRID ZIP (11X11)

TEXTOOL 268-6311-9UA-1902 PGA 11

3M

0
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
HLS-1313-G-18

HLS-1313-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-1313-G-18

Ficha técnica

HLS Bulk Active SIP 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
558-10-600M35-001104

558-10-600M35-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-600M35-001104

Ficha técnica

558 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-600M35-001105

518-77-600M35-001105

CONN SOCKET PGA 600POS GOLD

Preci-Dip

0
RFQ
518-77-600M35-001105

Ficha técnica

518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
32-6551-18

32-6551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
163-PRS15065-12

163-PRS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
163-PRS15065-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PLS17012-12

169-PLS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
169-PLS17012-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17012-12

169-PRS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
169-PRS17012-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17053-12

169-PRS17053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
169-PRS17053-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-600M35-001106

518-77-600M35-001106

CONN SOCKET PGA 600POS GOLD

Preci-Dip

0
RFQ
518-77-600M35-001106

Ficha técnica

518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-652M35-001101

558-10-652M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-652M35-001101

Ficha técnica

558 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
209-PRS17020-12

209-PRS17020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
209-PRS17020-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100265150

7100265150

TEXTOOLINTERSTITIAL PIN GRID ARR

3M

0
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
2100-6310-9UA-1902

2100-6310-9UA-1902

10X10 GRID ZIP SOCKET

3M

0
RFQ

-

- Bulk Obsolete - 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
180-PRS18007-12

180-PRS18007-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
180-PRS18007-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
196-PRS14001-12

196-PRS14001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
196-PRS14001-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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