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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
7100148803

7100148803

TEXTOOL1012-0-0289-0B-00L20 0.65

3M

0
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
192-PRS17027-12

192-PRS17027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
192-PRS17027-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7010402522

7010402522

TEXTOOLTEST & BURN-IN SOCKETS PL

3M

0
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
244-5205-00

244-5205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

0
RFQ

-

Textool™ Box Active - - - - - - - - - - - - - - -
216-PRS21016-12

216-PRS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
216-PRS21016-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
208-PLS17017-12

208-PLS17017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
208-PLS17017-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
32-3574-18

32-3574-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ
32-3574-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
32-6574-18

32-6574-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0
RFQ
32-6574-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
209-PRS17030-12

209-PRS17030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
209-PRS17030-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
209-PRS17046-12

209-PRS17046-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
209-PRS17046-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
176-PRS15014-12

176-PRS15014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
176-PRS15014-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
280-PLS19006-12

280-PLS19006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
280-PLS19006-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
280-PRS19006-12

280-PRS19006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
280-PRS19006-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
281-PRS19012-12

281-PRS19012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
281-PRS19012-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
179-PLS18038-12

179-PLS18038-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
179-PLS18038-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
179-PRS18038-12

179-PRS18038-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
179-PRS18038-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
281-PRS18037-12

281-PRS18037-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
281-PRS18037-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
32-3575-18

32-3575-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ
32-3575-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
32-6575-18

32-6575-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0
RFQ
32-6575-18

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
180-PLS18007-12

180-PLS18007-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
180-PLS18007-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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