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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
HSS10-B20-P40 HEAT SINK, STAMPING, TO-220, 29. Same Sky (Formerly CUI Devices)	1,614	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.1W @ 75°C	7.90°C/W @ 200 LFM	18.12°C/W	Aluminum Alloy	Black Anodized
ATS-PCB1043 HEATSINK TO-3 Advanced Thermal Solutions Inc.	2,221	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-3	Bolt On	Rhombus	2.507" (63.67mm)	1.867" (47.41mm)	-	1.667" (42.33mm)	-	2.60°C/W @ 200 LFM	7.50°C/W	Aluminum	Black Anodized
HSS11-B20-P38 HEAT SINK, STAMPING, TO-220, 50. Same Sky (Formerly CUI Devices)	2,150	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	2.000" (50.80mm)	1.260" (32.00mm)	-	0.500" (12.70mm)	4.8W @ 75°C	6.90°C/W @ 200 LFM	15.76°C/W	Aluminum Alloy	Black Anodized
V7477W2 HEATSINK ALUM ANOD Assmann WSW Components	1,725	-	RFQ	Ficha técnica	-	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	PC Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.500" (12.70mm)	-	-	14.00°C/W	Aluminum	Black Anodized
ATS-PCB1054 HEATSINK TO-220 ALUMINUM Advanced Thermal Solutions Inc.	1,232	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Angled Fins	2.362" (60.00mm)	0.985" (25.00mm)	-	0.335" (8.50mm)	-	6.70°C/W @ 200 LFM	12.00°C/W	Aluminum	Black Anodized
HSS03-B20-P318 HEAT SINK, STAMPING, TO-220, 41. Same Sky (Formerly CUI Devices)	1,556	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.640" (41.66mm)	1.300" (33.02mm)	-	0.470" (11.94mm)	5.5W @ 75°C	5.60°C/W @ 200 LFM	13.67°C/W	Aluminum Alloy	Black Anodized
V8510SN-T HEATSINK ALUM ANOD Assmann WSW Components	977	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Clip and Board Mounts	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.335" (8.50mm)	-	-	18.00°C/W	Aluminum	Tin
HSE02-173213 HEAT SINK, EXTRUSION, 17 X 31.9 Same Sky (Formerly CUI Devices)	3,116	-	RFQ	Ficha técnica	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.492" (12.50mm)	3.5W @ 75°C	6.70°C/W @ 200 LFM	21.44°C/W	Aluminum Alloy	Blue Anodized
HSS04-B20-P318 HEAT SINK, STAMPING, TO-220, 41. Same Sky (Formerly CUI Devices)	1,929	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.650" (41.91mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	5.9W @ 75°C	5.50°C/W @ 200 LFM	12.79°C/W	Aluminum Alloy	Black Anodized
V2028B HEATSINK CPU XCUT Assmann WSW Components	876	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.177" (29.90mm)	1.177" (29.90mm)	-	0.370" (9.40mm)	-	-	17.00°C/W	Aluminum Alloy	Black Anodized
V7477ZC HEATSINK ALUM ANOD Assmann WSW Components	192	-	RFQ	Ficha técnica	-	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Bolt On and PC Pin	Square, Pin Fins	1.098" (27.90mm)	1.098" (27.90mm)	-	0.500" (12.70mm)	-	-	7.00°C/W	Aluminum	Black Anodized
ATS-PCBT1082 HEATSINK TO-218 W/TAB BLACK Advanced Thermal Solutions Inc.	954	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and Board Mounts	Rectangular, Angled Fins	1.756" (44.60mm)	0.492" (12.50mm)	-	1.756" (44.60mm)	-	2.10°C/W @ 200 LFM	6.30°C/W	Aluminum	Black Anodized
ATS-PCB1055 HEATSINK TO-220 ALUMINUM Advanced Thermal Solutions Inc.	665	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.748" (19.00mm)	0.866" (22.00mm)	-	0.433" (11.00mm)	-	11.20°C/W @ 200 LFM	23.70°C/W	Aluminum	Black Anodized
TGH-0132-01 ALUMINIUM HEAT SINK 19X13.2MM t-Global Technology	997	-	RFQ	Ficha técnica	TGH	Bulk	Active	Board Level	-	Bolt On	Rectangular, Fins	0.748" (19.00mm)	0.520" (13.21mm)	-	0.382" (9.70mm)	-	-	-	Aluminum	Black Anodized
HSE01-193175 HEAT SINK, EXTRUSION, 19 X 31.5 Same Sky (Formerly CUI Devices)	1,538	-	RFQ	Ficha técnica	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.295" (7.50mm)	2.95W @ 75°C	9.20°C/W @ 200 LFM	25.44°C/W	Aluminum Alloy	Blue Anodized
ATS-PCB1059 HEATSINK TO-220 COPPER W/TAB Advanced Thermal Solutions Inc.	1,253	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	8.80°C/W @ 200 LFM	24.00°C/W	Copper	Tin
ATS-PCBT1091 HEATSINK TO-220 STEEL W/TAB Advanced Thermal Solutions Inc.	120	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular	0.787" (20.00mm)	1.220" (30.99mm)	-	0.032" (0.80mm)	-	13.00°C/W @ 200 LFM	25.00°C/W	Steel	Tin
HSS06-C20-P32 HEAT SINK, STAMPING, TO-220, 27. Same Sky (Formerly CUI Devices)	338	-	RFQ	Ficha técnica	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular	1.101" (27.96mm)	0.866" (22.00mm)	-	0.375" (9.52mm)	3.0W @ 75°C	10.60°C/W @ 200 LFM	25.35°C/W	Copper Alloy	Tin
ATS-PCB1003 HEATSINK TO-220 CLIPON W/TAB Advanced Thermal Solutions Inc.	1,219	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	1.500" (38.10mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	-	7.00°C/W @ 200 LFM	20.00°C/W	Aluminum	Black Anodized
ATS-PCB1036 HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc.	2,555	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.181" (30.00mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	-	7.00°C/W @ 200 LFM	13.40°C/W	Aluminum	Black Anodized

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