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Dissipadores de Calor

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
C60-075-AE

C60-075-AE

HEATSINK FOR TO-247 TO-264

Ohmite

0
RFQ
C60-075-AE

Ficha técnica

C60 Box Active Board Level, Vertical TO-220, TO-247, TO-264 Clip, Solder Foot Rectangular, Fins 2.950" (74.93mm) 2.480" (62.99mm) - 1.610" (40.89mm) - - - Aluminum Alloy Black Anodized
403V

403V

HEATSINK POWER TO-3

Wakefield-Vette

0
RFQ
403V

Ficha técnica

403 Bulk Active Board Level, Extrusion TO-3 Press Fit Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) - 1.250" (31.75mm) 30.0W @ 55°C 0.90°C/W @ 250 LFM - Aluminum Black Anodized
7-1542006-8

7-1542006-8

HEAT SINK BGA 29MM 7FIN RADIAL

TE Connectivity AMP Connectors

0
RFQ
7-1542006-8

Ficha técnica

- Tray Active - BGA Clip Cylindrical - - 2.000" (50.80mm) OD 0.892" (22.65mm) - 1.50°C/W @ 400 LFM - Aluminum Black Anodized
ATS-H1-40-C3-R0

ATS-H1-40-C3-R0

HEATSINK 57.9X60.96X11.43MM T412

Advanced Thermal Solutions Inc.

0
RFQ
ATS-H1-40-C3-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 2.400" (60.96mm) - 0.450" (11.43mm) - 14.61°C/W @ 100 LFM - Aluminum Blue Anodized
ATS-H1-30-C3-R0

ATS-H1-30-C3-R0

HEATSINK 70X70X25MM XCUT T412

Advanced Thermal Solutions Inc.

0
RFQ
ATS-H1-30-C3-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.756" (70.00mm) 2.756" (70.00mm) - 0.984" (25.00mm) - 5.35°C/W @ 100 LFM - Aluminum Blue Anodized
HSIBQ800-1

HSIBQ800-1

HEAT SPREADER FOR IBQ800 (H051HS

iBASE Technology

1
RFQ
HSIBQ800-1

Ficha técnica

- Box Active - - - - - - - - - - - - -
2334BG

2334BG

HEAT SINK

Boyd Laconia, LLC

0
RFQ
2334BG

Ficha técnica

- Bulk Active - - - - - - - - - - - - -
ATS-H1-42-C1-R0

ATS-H1-42-C1-R0

HEATSINK 57.9X60.96X22.86MM

Advanced Thermal Solutions Inc.

0
RFQ
ATS-H1-42-C1-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 2.400" (60.96mm) - 0.900" (22.86mm) - 7.30°C/W @ 100 LFM - Aluminum Blue Anodized
1542779-4

1542779-4

SALEABLE PACKAGED VERSION.

TE Connectivity AMP Connectors

0
RFQ
1542779-4

Ficha técnica

- Tray Active Top Mount - - Cylindrical - - 0.984" (24.99mm) OD 1.007" (25.58mm) - - - - -
5-1542009-5

5-1542009-5

35MM HEAT SINK ASSY .008" LIP

TE Connectivity AMP Connectors

0
RFQ
5-1542009-5

Ficha técnica

- Box Obsolete Top Mount BGA Clip Cylindrical - - 1.375" (34.92mm) OD 0.357" (9.07mm) - 6.32°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
FHS-A090025S43

FHS-A090025S43

DHA-B STANDARD COOLER

Delta Electronics

0
RFQ

-

- Bulk Active - - - - - - - - - - - - -
4-1542004-4

4-1542004-4

25MM HS ASSY ULTEM CL

TE Connectivity AMP Connectors

0
RFQ
4-1542004-4

Ficha técnica

- Box Active Top Mount BGA Clip Cylindrical - - 1.750" (44.45mm) OD 0.442" (11.23mm) - 5.34°C/W @ 200 LFM - Aluminum Black Anodized
FHS-A9025S19

FHS-A9025S19

FAN CPU COOLER 90X19.1MM 12VDC

Delta Electronics

0
RFQ
FHS-A9025S19

Ficha técnica

FHS Bulk Obsolete Board Level Intel LGA1156 CPU Cooler Bolt On Round - - 3.657" (92.90mm) OD 1.811" (46.00mm) - - 0.36°C/W Aluminum, Copper, Plastic -
MFH70-25W2/3.0-1

MFH70-25W2/3.0-1

AL HEAT SINK 70X70X25MM

Malico Inc.

0
RFQ

-

- Active - - - - - - - - - - - - -
ATS-H1-41-C3-R0

ATS-H1-41-C3-R0

HEATSINK 57.9X60.96X17.78MM T412

Advanced Thermal Solutions Inc.

0
RFQ
ATS-H1-41-C3-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 2.400" (60.96mm) - 0.700" (17.78mm) - 10.07°C/W @ 100 LFM - Aluminum Blue Anodized
8-1542005-8

8-1542005-8

32.5MM HS ASSY ULTEM

TE Connectivity AMP Connectors

0
RFQ
8-1542005-8

Ficha técnica

- Box Active Top Mount BGA Clip Cylindrical - - 1.375" (34.92mm) OD 0.357" (9.07mm) - 6.32°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
8-1542003-1

8-1542003-1

23MM HS ASSY A-TEMP C

TE Connectivity AMP Connectors

0
RFQ
8-1542003-1

Ficha técnica

- Tray Obsolete Top Mount BGA Clip Cylindrical - - 1.375" (34.92mm) OD 0.571" (14.50mm) - 5.26°C/W @ 200 LFM 12.30°C/W Aluminum Black Anodized
ATS-61300W-C1-R0

ATS-61300W-C1-R0

MAXIGRIP FANSINK 30X30X24.5MM

Advanced Thermal Solutions Inc.

0
RFQ
ATS-61300W-C1-R0

Ficha técnica

fanSINK, maxiGRIP Bulk Discontinued Top Mount BGA Clip, Thermal Material Square, Pin Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.965" (24.50mm) - 1.70°C/W @ 200 LFM - Aluminum Black Anodized
8-1542003-6

8-1542003-6

35MM LOW P HS ASSY A-

TE Connectivity AMP Connectors

0
RFQ
8-1542003-6

Ficha técnica

- Tray Active Top Mount BGA Clip Cylindrical - - 1.375" (34.92mm) OD 0.479" (12.17mm) - 5.74°C/W @ 200 LFM 11.00°C/W Aluminum Black Anodized
110991228

110991228

EXTREME COOLING FAN KIT FOR RASP

Seeed Technology Co., Ltd

0
RFQ
110991228

Ficha técnica

- Bulk Active Board Level Raspberry Pi 3 B+ Thermal Tape, Adhesive (Included) Rectangular - - - - - - - Copper -
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