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Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
1542615-2

1542615-2

HS PLTD

TE Connectivity AMP Connectors

0
RFQ

-

- Bag Active - - - - - - - - - - - - -
TXB2P050037ND

TXB2P050037ND

THERMAL LINK PRESS ON NKL TO-8

CTS Thermal Management Products

0
RFQ
TXB2P050037ND

Ficha técnica

- Tray Active Top Mount TO-8S Bolt On Cylindrical - 0.550" (13.97mm) 0.550" (13.97mm) OD - - - - Aluminum Dull Nickel
FIT0713

FIT0713

COLORFUL ICE TOWER COOLING FAN F

DFRobot

0
RFQ
FIT0713

Ficha técnica

ICE Tower Bulk Active Board Level Raspberry Pi 3B, 3B+, 4B Bolt On and Thermal Tape, Adhesive (Included) Rectangular - - - - - - - - -
114992160

114992160

XX

Seeed Technology Co., Ltd

0
RFQ

-

- Bulk Active Top Mount with Fan Raspberry Pi 3B, 3B+, 4B Bolt On and Thermal Tape, Adhesive (Included) - - - - - - - - - -
114991948

114991948

ICE TOWER CPU COOLING FAN FOR RA

Seeed Technology Co., Ltd

0
RFQ
114991948

Ficha técnica

ICE Tower Bulk Obsolete Board Level Raspberry Pi 3, 4, B+ Bolt On and Thermal Tape, Adhesive (Included) Rectangular - - - - - - - - -
HSET976-1

HSET976-1

HEAT SPREADER FOR ET976 (H051HSE

iBASE Technology

1
RFQ

-

- Box Active Heat Spreader ET976 - - - - - - - - - - -
423A

423A

HEATSINK POWER TO-3

Wakefield-Vette

0
RFQ
423A

Ficha técnica

423 Bulk Active Board Level, Extrusion TO-3, DO-5, Stud Mount Press Fit Rectangular, Fins 5.500" (139.70mm) 4.750" (120.65mm) - 2.625" (66.67mm) 50.0W @ 47°C 0.50°C/W @ 250 LFM 0.96°C/W Aluminum Black Anodized
1542614-2

1542614-2

HS PLTD

TE Connectivity AMP Connectors

0
RFQ

-

- Tray Active - - - - - - - - - - - - -
438C-480MMB-CKP

438C-480MMB-CKP

WEDGELOCK 4.80" ANODIZE

Wakefield-Vette

0
RFQ
438C-480MMB-CKP

Ficha técnica

- Bulk Active - - - - - - - - - - - - -
421V

421V

HEATSINK POWER TO-3

Wakefield-Vette

0
RFQ
421V

Ficha técnica

421 Bulk Active Board Level, Extrusion TO-3, DO-5, Stud Mount Press Fit Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) - 2.625" (66.67mm) 50.0W @ 58°C 0.70°C/W @ 250 LFM 1.16°C/W Aluminum Black Anodized
125362

125362

1.45WX36" EXTRUSION 14363

Wakefield-Vette

0
RFQ
125362

Ficha técnica

- Box Active Top Mount, Extrusion DC/DC Converter Adhesive Rectangular, Fins 36.000" (914.40mm) 1.450" (36.83mm) - 0.768" (19.50mm) - - 1.05°C/W Aluminum -
125337

125337

4.6WX12" EXTRUSION 12614

Wakefield-Vette

0
RFQ
125337

Ficha técnica

- Box Active Top Mount, Extrusion DC/DC Converter Adhesive Rectangular, Fins 12.000" (304.80mm) 4.600" (116.84mm) - 0.900" (22.86mm) - - 0.53°C/W Aluminum -
IBR115 HEATSINK

IBR115 HEATSINK

HSIBR115-A (HEATSINK W/ SCREWS A

iBASE Technology

1
RFQ

-

- Box Active Top Mount IBR115 Push Pin Rectangular, Fins 2.520" (64.00mm) 2.126" (54.00mm) - 0.628" (15.95mm) - - - - -
KK0803-04A

KK0803-04A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0
RFQ

-

TE0803 Bulk Active Heat Spreader TE0803-03, TE0803-04 Bolt On Rectangular 2.992" (76.00mm) 2.047" (52.00mm) - 0.354" (9.00mm) - - - - -
SKV808012-CU

SKV808012-CU

COPPER HEATSINK 80X80X12MM

Wakefield-Vette

0
RFQ
SKV808012-CU

Ficha técnica

SKV Bulk Active Top Mount, Skived - Push Pin Square, Fins 3.150" (80.00mm) 3.150" (80.00mm) - 0.472" (12.00mm) - 1.20°C/W @ 200 LFM 5.10°C/W Copper -
TXB2P019028ND

TXB2P019028ND

THERMAL LINK PRESS ON NICKEL TO-

CTS Thermal Management Products

0
RFQ
TXB2P019028ND

Ficha técnica

- Tray Obsolete Top Mount TO-18 Press Fit, Bolt On Cylindrical 0.280" (7.11mm) 0.220" (5.59mm) 0.220" (5.59mm) OD - - - 108.00°C/W Brass Dull Nickel
1542335-3

1542335-3

HTSC01-3=HS PLTD GF INTERFACE

TE Connectivity AMP Connectors

0
RFQ

-

- Bag Active - - - - - - - - - - - - -
431K

431K

HEATSINK FOR PWR SEMI

Wakefield-Vette

0
RFQ
431K

Ficha técnica

431 Bulk Active Board Level, Extrusion Stud Mounted Diode Press Fit Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) - 3.000" (76.20mm) 50.0W @ 55°C 0.40°C/W @ 250 LFM - Aluminum Black Anodized
1542008-5

1542008-5

40MM THICK HS ASS'Y ULTEM CLIP

TE Connectivity AMP Connectors

0
RFQ
1542008-5

Ficha técnica

- Box Obsolete Top Mount BGA Clip Cylindrical - - 2.750" (69.85mm) OD 0.310" (7.87mm) - - - Aluminum Black Anodized
421F

421F

HEATSINK POWER TO-3

Wakefield-Vette

0
RFQ
421F

Ficha técnica

421 Bulk Active Board Level, Extrusion TO-3, DO-5, Stud Mount Press Fit Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) - 2.625" (66.67mm) 50.0W @ 58°C 0.70°C/W @ 250 LFM 1.16°C/W Aluminum Black Anodized
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