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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Pacote/Caixa | Embalagem | Status do produto | Aplicações | Corrente - Alimentação | Voltagem - Alimentação | Temperatura operacional | Grau | Qualificação | Tipo de montagem | Pacote do dispositivo do fornecedor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS6510CAER2FS6500 |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
|
MC33FS6501CAESYSTEM BASIS CHIP DCDC 0.8A VCO |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
71M6403-IGT/FIC ELECTRONIC TRIP UNIT 100-LQFP |
0 |
|
Ficha técnica |
- | 100-LQFP | Bulk | Discontinued | Electronic Trip Unit | - | - | - | - | - | Surface Mount | 100-LQFP (14x14) |
|
|
MFS2632AMDA0ADAUTO SBC |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tray | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
|
LM25066IPSQE/NOPBIC PWR MGMT/PROT PMBUS 24WQFN |
0 |
|
Ficha técnica |
- | 24-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Base Station-Networking Line Cards, Servers | 5.8mA | 2.9V ~ 17V | -40°C ~ 85°C | - | - | Surface Mount | 24-WQFN (4x5) |
|
|
MC33FS6517LAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
|
MC33FS6518NAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33816AEIC SOLENOID CTRLR PROGRAMMABLE |
0 |
|
- |
- | 64-LQFP Exposed Pad | Tray | Active | Solenoid Controller | - | - | -40°C ~ 125°C | - | - | Surface Mount | 64-LQFP (10x10) |
|
|
MC33FS6526NAESYSTEM BASIS CHIP, DCDC 2.2A VCO |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 2.7V ~ 40V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
|
MPF7100BMBA0ESR2POWER MANAGEMENT IC, I.MX 8, I.M |
0 |
|
Ficha técnica |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC34PF8100CFEPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100CCEPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100A0EPR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100F3EPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC34PF8100CHEPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100EPEPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100EREPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC34PF8100EQEPR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Ficha técnica |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
BQ501210RGCRWIRELESS POWER MEDIUM POWER TRAN |
0 |
|
Ficha técnica |
- | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Not For New Designs | Wireless Power Transmitter | 52mA | 3V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 64-VQFN (9x9) |
|
|
MC35FS4505CAESYSTEM BASIS CHIP, LINEAR 0.5A V |
0 |
|
Ficha técnica |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
