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Cabeçalhos, pinos machos
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo de conector | Tipo de contato | Passo - Acoplamento | Número de posições | Número de Linhas | Espaçamento de Linha - Acoplamento | Número de posições carregadas | Estilo | Cobertura | Tipo de montagem | Terminação | Fixação Tipo | Comprimento do Contato - Acoplamento | Comprimento do Contato - Poste | Comprimento Geral do Contato | Altura do Isolamento | Formato do Contato | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Acabamento de Contato - Poste | Material de Contato | Material de Isolamento | Recursos | Temperatura operacional | Classificação de Corrente (Amps) |
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SL 4 025 62 ZMALE HEADER 0.635 MM, DIMENSIO |
0 |
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Ficha técnica |
SL 4 025 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.118" (3.00mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 8 S B TR0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 4 025 58 SMALE HEADER 0.635 MM, DIMENSIO |
0 |
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Ficha técnica |
SL 4 025 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.118" (3.00mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 030 24 S0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 3 131 27 ZMALE HEADER 0.635 MM, DIMENSIO |
0 |
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Ficha técnica |
SL 3 131 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 27 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.516" (13.10mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 055 31 Z0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 3 207 36 SMALE HEADER 0.635 MM, DIMENSIO |
0 |
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Ficha técnica |
SL 3 207 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.228" (5.80mm) | 0.815" (20.70mm) | - | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 30 Z0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 237 23 SONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 237 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 23 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.299" (33.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 38 G B SM PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 38 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 315 3 ZONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 315 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 3 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 6 S0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 197 10 GONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 197 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 16 Z SM0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 4 S B SM0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 121 25 GONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 121 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 16 Z B TR PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 172 18 GONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 172 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 18 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.043" (26.50mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 32 G0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Ficha técnica |
SL LP 7 SMD 040 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 121 35 GONE ROW, 0.635 MM |
0 |
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Ficha técnica |
SL 5 121 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 35 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
