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Cabeçalhos, pinos machos
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo de conector | Tipo de contato | Passo - Acoplamento | Número de posições | Número de Linhas | Espaçamento de Linha - Acoplamento | Número de posições carregadas | Estilo | Cobertura | Tipo de montagem | Terminação | Fixação Tipo | Comprimento do Contato - Acoplamento | Comprimento do Contato - Poste | Comprimento Geral do Contato | Altura do Isolamento | Formato do Contato | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Acabamento de Contato - Poste | Material de Contato | Material de Isolamento | Recursos | Temperatura operacional | Classificação de Corrente (Amps) |
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SLY 10 SMD 040 46 Z0.5 MM |
0 |
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Ficha técnica |
SLY 10 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 46 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.268" (6.80mm) | - | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 6 092 14 GONE ROW, 0.4 MMFOR INT |
0 |
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Ficha técnica |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 14 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 11 ZONE ROW, 0.4 MMFOR INT |
0 |
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Ficha técnica |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 11 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 10 SMD 040 50 Z0.5 MM |
0 |
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Ficha técnica |
SLY 10 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 50 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.268" (6.80mm) | - | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 6 092 13 ZONE ROW, 0.4 MMFOR INT |
0 |
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Ficha técnica |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 50 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 4 KA 060 4 ZGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
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Ficha técnica |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 097 58 Z0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.748" (19.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 12 GGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
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Ficha técnica |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 12 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SL 6 071 16 Z0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 071 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.646" (16.40mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 1 139 32 S0.5 MM, STRAIGHT |
0 |
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Ficha técnica |
SLY 1 139 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.370" (9.40mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 156 14 Z0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 156 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.980" (24.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 31 GONE ROW, 0.5 MM, SUITABLE FOR |
0 |
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Ficha técnica |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 31 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 315 22 Z0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 315 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 28 SONE ROW, 0.5 MM, SUITABLE FOR |
0 |
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Ficha técnica |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 097 40 S0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 097 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.748" (19.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 12 SMD 092 4 STWO ROWS, 0.5 MM, SUITABLE FOR |
0 |
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Ficha técnica |
SLY 12 SMD 092 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 4 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 237 52 Z0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 237 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 52 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.299" (33.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLV W 7 117 52 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Ficha técnica |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 52 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL 6 121 32 G0.635 MM"S" SE |
0 |
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Ficha técnica |
SL 6 121 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.845" (21.40mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
