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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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01-0508-20CONN SOCKET SIP 1POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
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01-0508-30CONN SOCKET SIP 1POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
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AW 127-30/Z-TSOCKET 30 CONTACTS SINGLE ROW |
0 |
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Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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AJ 28-LCSOCKET |
0 |
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- |
- | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
116-87-304-41-011101CONN IC DIP SOCKET 4POS GOLD |
0 |
|
Ficha técnica |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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PRT-07939DIP SOCKETS SOLDER TAIL - 14-PIN |
0 |
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- |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - | - |
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PRT-07938DIP SOCKETS SOLDER TAIL - 16-PIN |
0 |
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- |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - | - |
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HLS-0103-TT-10.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
Ficha técnica |
HLS | Tube | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
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110-87-314-41-605101CONN IC DIP SOCKET 14POS GOLD |
0 |
|
Ficha técnica |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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AR28-HZL-TTCONN IC DIP SOCKET 28POS TIN |
0 |
|
Ficha técnica |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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A-CCS20-Z-RCONN SOCKET PLCC 20POS TIN |
0 |
|
Ficha técnica |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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115-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
0 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-304-41-008101CONN IC DIP SOCKET 4POS GOLD |
0 |
|
Ficha técnica |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
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05-0518-10HCONN SOCKET SIP 5POS GOLD |
0 |
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Ficha técnica |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
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06-1518-10CONN IC DIP SOCKET 6POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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04-0513-10TCONN SOCKET SIP 4POS GOLD |
0 |
|
Ficha técnica |
0513 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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808-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
0 |
|
Ficha técnica |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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SBU130ZCONN SOCKET SIP 13POS GOLD |
0 |
|
Ficha técnica |
SBU | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
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02-0513-11CONN SOCKET SIP 2POS GOLD |
0 |
|
Ficha técnica |
0513 | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
110-83-306-41-105101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
Ficha técnica |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
