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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
210748-5

210748-5

CONN SOCKET PGA 6POS TIN-LEAD

TE Connectivity AMP Connectors

0
RFQ
210748-5

Ficha técnica

- Tube Obsolete PGA 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester, Glass Filled -
BU320Z

BU320Z

CONN IC DIP SOCKET 32POS

On Shore Technology Inc.

0
RFQ

-

BU - Active - 32 (2 x 16) - - - - - - - - - - - - -
116-87-624-41-006101

116-87-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-87-624-41-006101

Ficha técnica

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-9513-10T

06-9513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-9513-10T

Ficha técnica

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-0513-10H

12-0513-10H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0
RFQ
12-0513-10H

Ficha técnica

0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-1518-10H

20-1518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-1518-10H

Ficha técnica

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-1518-10T

22-1518-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0
RFQ
22-1518-10T

Ficha técnica

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-1518-10

24-1518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0
RFQ
24-1518-10

Ficha técnica

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0104-G-11

HLS-0104-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-G-11

Ficha técnica

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
SIP050-1X29-157B

SIP050-1X29-157B

1X29-157B-SIP SOCKET 29 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X29-157B

Ficha técnica

SIP050-1x Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
540-88-052-24-008

540-88-052-24-008

CONN SOCKET PLCC 52POS TIN

Preci-Dip

0
RFQ
540-88-052-24-008

Ficha técnica

540 Bulk Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
HLS-0401-T-2

HLS-0401-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0401-T-2

Ficha técnica

HLS Bulk Active SIP 4 (4 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-2004-T-10

HLS-2004-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-2004-T-10

Ficha técnica

HLS Bulk Active SIP 80 (20 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
115-83-624-41-003101

115-83-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
115-83-624-41-003101

Ficha técnica

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-006101

116-83-320-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
116-83-320-41-006101

Ficha técnica

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D0820-01

D0820-01

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

0
RFQ
D0820-01

Ficha técnica

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
516-AG10D-ESL

516-AG10D-ESL

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0
RFQ
516-AG10D-ESL

Ficha técnica

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
HLS-0104-T-12

HLS-0104-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-T-12

Ficha técnica

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-052-09-041101

510-87-052-09-041101

CONN SOCKET PGA 52POS GOLD

Preci-Dip

0
RFQ
510-87-052-09-041101

Ficha técnica

510 Bulk Active PGA 52 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0104-T-18

HLS-0104-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-T-18

Ficha técnica

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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