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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A-CCS 084-Z-SMCONN SOCKET PLCC 84POS TIN |
392 |
|
Ficha técnica |
- | Tube | Active | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled | -40°C ~ 105°C |
|
A-CCS 020-G-TCONN SOCKET PLCC 20POS GOLD |
265 |
|
Ficha técnica |
- | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -40°C ~ 105°C |
|
XR2C1011NCONN SOCKET SIP 10POS GOLD |
395 |
|
Ficha técnica |
XR2 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
24-6518-10CONN IC DIP SOCKET 24POS GOLD |
185 |
|
Ficha técnica |
518 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
D2824-42CONN IC DIP SOCKET 24POS GOLD |
2,434 |
|
Ficha técnica |
D2 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic | -55°C ~ 125°C |
|
917-47-208-41-005000CONN SOCKET TRANSIST TO-5 8POS |
174 |
|
Ficha técnica |
917 | Tube | Active | Transistor, TO-100 | 8 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-47-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
168 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
ICA-314-SSTCONN IC DIP SOCKET 14POS GOLD |
316 |
|
Ficha técnica |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
8452-21A1-RK-TPCONN SOCKET PLCC 52POS TIN |
577 |
|
Ficha técnica |
8400 | Tube | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
69802-444LFCONN SOCKET PLCC 44POS TINLEAD |
1,726 |
|
Ficha técnica |
69802 | Tape & Reel (TR) | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 125°C |
|
ICA-324-STTCONN IC DIP SOCKET 24POS TIN |
612 |
|
Ficha técnica |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
210-93-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
354 |
|
Ficha técnica |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-99-632-41-001000CONN IC DIP SOCKET 32POS TINLEAD |
186 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-93-314-41-003000CONN IC DIP SOCKET 14POS GOLD |
130 |
|
Ficha técnica |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
917-43-103-41-001000CONN TRANSIST TO-5 3POS GOLD |
351 |
|
Ficha técnica |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
114-87-628-41-117101CONN IC DIP SOCKET 28POS GOLD |
104 |
|
Ficha técnica |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ICA-308-SGGCONN IC DIP SOCKET 8POS GOLD |
138 |
|
Ficha técnica |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
A-CCS 032-G-TCONN SOCKET PLCC 32POS GOLD |
918 |
|
Ficha técnica |
- | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -40°C ~ 105°C |
|
D2822-42CONN IC DIP SOCKET 22POS GOLD |
1,057 |
|
Ficha técnica |
D2 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic | -55°C ~ 125°C |
|
110-47-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
262 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
