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Soquetes de CI

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Número de posições ou pinos (grade)	Passo - Acoplamento	Acabamento do contato - Acoplamento	Espessura do Acabamento de Contato - Acoplamento	Material de Contato - Acoplamento	Tipo de montagem	Recursos	Terminação	Passo - Poste	Acabamento de Contato - Poste	Espessura do Acabamento de Contato - Poste	Material de Contato - Poste	Material do invólucro	Temperatura operacional
317-47-108-41-005000 CONN SOCKET SIP 8POS GOLD Mill-Max Manufacturing Corp.	470	-	RFQ	Ficha técnica	317	Tube	Active	SIP	8 (1 x 8)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-308-T-O CONN IC DIP SOCKET 8POS TIN Samtec Inc.	16	-	RFQ	Ficha técnica	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
XR2A-0815 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	118	-	RFQ	Ficha técnica	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
110-47-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	225	-	RFQ	Ficha técnica	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 14-HZL/07-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	2,942	-	RFQ	Ficha técnica	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
115-47-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	440	-	RFQ	Ficha técnica	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,264	-	RFQ	Ficha técnica	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
214-99-314-01-670800 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	356	-	RFQ	Ficha técnica	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	282	-	RFQ	Ficha técnica	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-020-24-000000 CONN SOCKET PLCC 20POS TIN Mill-Max Manufacturing Corp.	105	-	RFQ	Ficha técnica	940	Tube	Active	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-47-314-41-006000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	570	-	RFQ	Ficha técnica	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	345	-	RFQ	Ficha técnica	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	308	-	RFQ	Ficha técnica	210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	332	-	RFQ	Ficha técnica	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-2513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	338	-	RFQ	Ficha técnica	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
317-47-116-41-005000 CONN SOCKET SIP 16POS GOLD Mill-Max Manufacturing Corp.	190	-	RFQ	Ficha técnica	317	Tube	Active	SIP	16 (1 x 16)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-99-318-01-670800 CONN IC DIP SOCKET 18POS TINLEAD Mill-Max Manufacturing Corp.	390	-	RFQ	Ficha técnica	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-44-318-01-670800 CONN IC DIP SOCKET 18POS TIN Mill-Max Manufacturing Corp.	362	-	RFQ	Ficha técnica	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-99-320-01-670800 CONN IC DIP SOCKET 20POS TINLEAD Mill-Max Manufacturing Corp.	789	-	RFQ	Ficha técnica	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-47-628-41-605000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	242	-	RFQ	Ficha técnica	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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