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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1981837-2CONN SOCKET LGA 1366POS GOLD |
0 |
|
Ficha técnica |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
|
|
APA-316-G-NADAPTER PLUG |
0 |
|
Ficha técnica |
APA | Tube | Active | - | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
ICO-640-MGT.100" LOW PROFILE SCREW MACHINE |
0 |
|
Ficha técnica |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
101-93-422-41-560000CONN IC DIP SOCKET 22POS GOLD |
486 |
|
Ficha técnica |
101 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-93-420-41-001000CONN IC DIP SOCKET 20POS GOLD |
538 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-43-632-10-002000CONN IC DIP SOCKET 32POS GOLD |
300 |
|
Ficha técnica |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-43-424-41-003000CONN IC DIP SOCKET 24POS GOLD |
488 |
|
Ficha técnica |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
ICF-640-S-O-TR.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
Ficha técnica |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
|
ICO-640-NGT.100" LOW PROFILE SCREW MACHINE |
0 |
|
Ficha técnica |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
116-93-318-41-007000CONN IC DIP SOCKET 18POS GOLD |
892 |
|
Ficha técnica |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
8059-2G5CONN SOCKET TRANSIST TO-5 8POS |
0 |
|
Ficha técnica |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
|
2-1437531-2CONN IC DIP SOCKET 14POS GOLD |
0 |
|
Ficha técnica |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
117-93-628-41-005000CONN IC DIP SOCKET 28POS GOLD |
193 |
|
Ficha técnica |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
3-1437508-1CONN TRANSIST TO-5 8POS GOLD |
0 |
|
Ficha técnica |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
2-822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
0 |
|
Ficha técnica |
- | Tube | Obsolete | QFP | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
2201838-2CONN SOCKET LGA 2011POS GOLD |
0 |
|
Ficha técnica |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | - |
|
|
2201838-1CONN SOCKET LGA 2011POS GOLD |
0 |
|
Ficha técnica |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
ASPI0002-P001ASPI 8Pin WSON 8X6 |
3,430 |
|
Ficha técnica |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ASPI0001-P001ASPI 8 PIN_IC 150mil |
1,710 |
|
Ficha técnica |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ACA-SPI-004-K01SPI 8 PIN_IC 208mil |
1,660 |
|
Ficha técnica |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
