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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
110-43-314-41-801000

110-43-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

80
RFQ
110-43-314-41-801000

Ficha técnica

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-308-10-001000

299-93-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

38
RFQ
299-93-308-10-001000

Ficha técnica

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-640-41-001000

111-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

76
RFQ
111-93-640-41-001000

Ficha técnica

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-41-801000

110-43-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

79
RFQ
110-43-316-41-801000

Ficha técnica

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-314-41-001000

123-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

52
RFQ
123-13-314-41-001000

Ficha técnica

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-430-41-005000

117-93-430-41-005000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

53
RFQ
117-93-430-41-005000

Ficha técnica

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-320-41-801000

110-43-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

98
RFQ
110-43-320-41-801000

Ficha técnica

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-314-11-001000

299-93-314-11-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

74
RFQ
299-93-314-11-001000

Ficha técnica

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-324-41-001000

123-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

52
RFQ
123-93-324-41-001000

Ficha técnica

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-624-41-001000

123-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

43
RFQ
123-93-624-41-001000

Ficha técnica

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-628-NGT

ICO-628-NGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

41
RFQ
ICO-628-NGT

Ficha técnica

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
110-13-314-41-801000

110-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

67
RFQ
110-13-314-41-801000

Ficha técnica

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6518-10

48-6518-10

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

73
RFQ
48-6518-10

Ficha técnica

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-13-316-41-001000

123-13-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

41
RFQ
123-13-316-41-001000

Ficha técnica

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-823-90

08-823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

58
RFQ
08-823-90

Ficha técnica

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
XR2P2041

XR2P2041

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

96
RFQ
XR2P2041

Ficha técnica

XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
123-93-328-41-001000

123-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

79
RFQ
123-93-328-41-001000

Ficha técnica

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-628-41-001000

123-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

34
RFQ
123-93-628-41-001000

Ficha técnica

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-642-41-005000

117-93-642-41-005000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

70
RFQ
117-93-642-41-005000

Ficha técnica

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-320-41-801000

110-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

92
RFQ
110-13-320-41-801000

Ficha técnica

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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