Disponível 24/7 em
+86 13632816717
Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2T-2021-NCONN IC DIP SOCKET 20POS GOLD |
0 |
|
Ficha técnica |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Ficha técnica |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
ICO-316-SGG.100" LOW PROFILE SCREW MACHINE |
0 |
|
Ficha técnica |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
XR2A-0802CONN IC DIP SOCKET 8POS GOLD |
54 |
|
Ficha técnica |
XR2 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
524-AG11D-ESCONN IC DIP SOCKET 24POS GOLD |
0 |
|
Ficha técnica |
500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
3-1571551-2CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
528-AG12DCONN IC DIP SOCKET 28POS TIN |
81 |
|
Ficha técnica |
500 | Tray | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyester | -55°C ~ 105°C |
|
110-13-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
80 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
848-AG10DCONN IC DIP SOCKET 48POS GOLD |
41 |
|
Ficha técnica |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
299-93-318-10-001000CONN IC DIP SOCKET 18POS GOLD |
64 |
|
Ficha técnica |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-43-616-10-002000CONN IC DIP SOCKET 16POS GOLD |
84 |
|
Ficha técnica |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
117-43-652-41-005000CONN IC DIP SOCKET 52POS GOLD |
32 |
|
Ficha técnica |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
2043650006P&S Conn 6MM CST SMT SOCKET W/1M |
15 |
|
Ficha técnica |
* | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
3-1571550-2CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
8060-1G9CONN TRANSIST TO-5 3POS GOLD |
0 |
|
Ficha técnica |
8060 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
2-1437504-68060-1G9=GOLD TRANSISTOR SOCKE |
38 |
|
Ficha técnica |
8060 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
110-13-628-41-801000CONN IC DIP SOCKET 28POS GOLD |
86 |
|
Ficha técnica |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
2040540-2CONN SOCKET LGA 1156POS GOLD |
0 |
|
Ficha técnica |
- | Tray | Active | LGA | 1156 (34 x 34) | 0.036" (0.91mm) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.039" (1.00mm) | - | - | Copper Alloy | Thermoplastic | - |
|
117-43-664-41-005000CONN IC DIP SOCKET 64POS GOLD |
53 |
|
Ficha técnica |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APA-324-G-NADAPTER PLUG |
0 |
|
Ficha técnica |
APA | Bulk | Active | - | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
