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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
APH-1918-G-T

APH-1918-G-T

APH-1918-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0618-G-T

APH-0618-G-T

APH-0618-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1118-G-T

APH-1118-G-T

APH-1118-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0218-G-T

APH-0218-G-T

APH-0218-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1318-G-T

APH-1318-G-T

APH-1318-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0718-G-T

APH-0718-G-T

APH-0718-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1618-G-T

APH-1618-G-T

APH-1618-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0818-G-T

APH-0818-G-T

APH-0818-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1218-G-T

APH-1218-G-T

APH-1218-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0318-G-T

APH-0318-G-T

APH-0318-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
133-PGM13046-10

133-PGM13046-10

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM13046-10

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
133-PGM14013-10

133-PGM14013-10

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM14013-10

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
160-PGM15056-10

160-PGM15056-10

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
160-PGM15056-10

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-121-13-061112

614-83-121-13-061112

CONN SOCKET PGA 121POS GOLD

Preci-Dip

0
RFQ
614-83-121-13-061112

Ficha técnica

614 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-41-642-41-001000

116-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-41-642-41-001000

Ficha técnica

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-642-41-001000

116-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-91-642-41-001000

Ficha técnica

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
316-93-132-41-001000

316-93-132-41-001000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

0
RFQ
316-93-132-41-001000

Ficha técnica

316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-163-31-018000

714-43-163-31-018000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-163-31-018000

Ficha técnica

714 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6556-30

48-6556-30

UNIVERSAL TEST SOCKET 48POS

Aries Electronics

0
RFQ

-

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
48-3551-10

48-3551-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

0
RFQ
48-3551-10

Ficha técnica

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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