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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
517-83-280-18-101111

517-83-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip

0
RFQ
517-83-280-18-101111

Ficha técnica

517 Bulk Active PGA 280 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1414-G-H

APH-1414-G-H

APH-1414-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0514-G-H

APH-0514-G-H

APH-0514-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0614-G-H

APH-0614-G-H

APH-0614-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0714-G-H

APH-0714-G-H

APH-0714-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1614-G-H

APH-1614-G-H

APH-1614-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0314-G-H

APH-0314-G-H

APH-0314-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
122-13-318-41-801000

122-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
122-13-318-41-801000

Ficha técnica

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-650-41-001000

123-91-650-41-001000

SOCKET IC OPEN 3 LVL .600 50POS

Mill-Max Manufacturing Corp.

0
RFQ

-

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-650-41-001000

123-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-41-650-41-001000

Ficha técnica

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-13-328-41-001000

612-13-328-41-001000

SOCKET CARRIER SLDRTL .300 28POS

Mill-Max Manufacturing Corp.

0
RFQ
612-13-328-41-001000

Ficha técnica

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-13-428-41-001000

612-13-428-41-001000

SOCKET CARRIER SLDRTL .400 28POS

Mill-Max Manufacturing Corp.

0
RFQ
612-13-428-41-001000

Ficha técnica

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-13-628-41-001000

612-13-628-41-001000

SOCKET CARRIER SLDRTL .600 28POS

Mill-Max Manufacturing Corp.

0
RFQ
612-13-628-41-001000

Ficha técnica

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-210-61-006000

116-43-210-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-210-61-006000

116-93-210-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
64-9518-10TE

64-9518-10TE

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0
RFQ
64-9518-10TE

Ficha técnica

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-43-432-41-004000

612-43-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-43-432-41-004000

Ficha técnica

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-632-41-004000

612-43-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-43-632-41-004000

Ficha técnica

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-432-41-004000

612-93-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-93-432-41-004000

Ficha técnica

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-632-41-004000

612-93-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-93-632-41-004000

Ficha técnica

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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