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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
612-93-952-41-001000

612-93-952-41-001000

SOCKET CARRIER SLDRTL .900 52POS

Mill-Max Manufacturing Corp.

0
RFQ
612-93-952-41-001000

Ficha técnica

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-952-41-001000

612-43-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-43-952-41-001000

Ficha técnica

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-424-61-001000

110-93-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0508-G-38

HLS-0508-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0508-G-38

Ficha técnica

HLS Bulk Active SIP 40 (5 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
APH-0440-T-R

APH-0440-T-R

APH-0440-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0940-T-R

APH-0940-T-R

APH-0940-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-T-R

APH-0640-T-R

APH-0640-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0740-T-R

APH-0740-T-R

APH-0740-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
612-13-642-41-001000

612-13-642-41-001000

SOCKET CARRIER SLDRTL .600 42POS

Mill-Max Manufacturing Corp.

0
RFQ
612-13-642-41-001000

Ficha técnica

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-93-264-31-018000

714-93-264-31-018000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.

0
RFQ
714-93-264-31-018000

Ficha técnica

714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-318-61-605000

110-93-318-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-950-41-003000

126-41-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
126-41-950-41-003000

Ficha técnica

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-950-41-003000

126-91-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
126-91-950-41-003000

Ficha técnica

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-61-605000

110-93-640-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-314-61-006000

116-43-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-314-61-006000

116-93-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-636-61-105000

110-43-636-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-636-61-105000

110-93-636-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-648-G-A1

APA-648-G-A1

ADAPTER PLUG

Samtec Inc.

0
RFQ
APA-648-G-A1

Ficha técnica

APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
28-3572-11

28-3572-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

0
RFQ
28-3572-11

Ficha técnica

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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