Por favor, contacte-nos para obter os preços mais recentes e a quantidade disponível.
EASTECH ElectronicsRastreamento de Pedido EASTECH ElectronicsMinha Conta
Idioma
    Pesquisas Populares M378A1K43CB2-CTD 900-5G132-2240-000 MMF404326 CONNECTOR-GX12-4 900-5G132-2560-000 900-5G190-2570-000 900-5G132-2260-000 FT100-950 9,5/4,8 tr 2101504-1 900-5G132-2540-000
    EASTECH Electronics

    Disponível 24/7 em

    +86 13632816717
    EASTECH Electronics EASTECH Electronics
    Todas as Categorias
    Início > Produtos  > Conectores, Interconexões > Soquetes para CIs, Transistores > Soquetes de CI

    Soquetes de CI

    Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
    110-43-314-61-801000

    110-43-314-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-652-41-001000

    612-13-652-41-001000

    SOCKET CARRIER SLDRTL .600 52POS

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		612-13-652-41-001000

    Ficha técnica

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-001000

    416-93-264-41-001000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		416-93-264-41-001000

    Ficha técnica

         		416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    116-43-318-61-001000

    116-43-318-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-61-001000

    116-93-318-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3570-11

    32-3570-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 0
    RFQ
    		32-3570-11

    Ficha técnica

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3571-11

    32-3571-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 0
    RFQ
    		32-3571-11

    Ficha técnica

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3572-11

    32-3572-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 0
    RFQ
    		32-3572-11

    Ficha técnica

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3573-11

    32-3573-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 0
    RFQ
    		32-3573-11

    Ficha técnica

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3575-11

    32-3575-11

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 0
    RFQ
    		32-3575-11

    Ficha técnica

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-149-15-063101

    550-10-149-15-063101

    PGA SOLDER TAIL

    Preci-Dip

    		 0
    RFQ
    		550-10-149-15-063101

    Ficha técnica

         		550 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-43-132-14-071001

    510-43-132-14-071001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		510-43-132-14-071001

    Ficha técnica

         		510 Tube Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-428-61-003000

    116-43-428-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-328-61-003000

    116-93-328-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-648-61-003000

    116-43-648-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-964-41-001000

    612-93-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		612-93-964-41-001000

    Ficha técnica

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-964-41-001000

    612-43-964-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		612-43-964-41-001000

    Ficha técnica

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-964-41-770000

    104-13-964-41-770000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		104-13-964-41-770000

    Ficha técnica

         		104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    111-43-952-61-001000

    111-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-424-61-008000

    116-43-424-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 820821822823824825826827...955Next»

    Comece agora!

    Obtenha as últimas notícias

    EASTECH Electronics

    Início

     EASTECH Electronics

    Pesquisar

     EASTECH Electronics

    Produtos

     EASTECH Electronics

    Whatsapp
    EASTECH Electronics
    [email protected]
    +86 13632816717
    Enviando...
    ×
    ✓
    Enviado com sucesso!
    Obrigado pelo seu envio, nossa equipe de vendas receberá sua solicitação e entraremos em contato dentro de 12 horas com uma cotação.
    OK