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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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324-93-164-41-002000CONN SOCKET SIP 64POS GOLD |
0 |
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Ficha técnica |
324 | Tube | Active | SIP | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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122-13-952-41-001000CONN IC DIP SOCKET 52POS GOLD |
0 |
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Ficha técnica |
122 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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28-3508-21CONN IC DIP SOCKET 28POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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28-3508-31CONN IC DIP SOCKET 28POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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APH-1830-G-TAPH-1830-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1530-G-TAPH-1530-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0530-G-TAPH-0530-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1030-G-TAPH-1030-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0630-G-TAPH-0630-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0230-G-TAPH-0230-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0330-G-TAPH-0330-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1330-G-TAPH-1330-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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110-43-652-61-105000CONN IC SKT DBL |
0 |
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- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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110-43-952-61-105000CONN IC SKT DBL |
0 |
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- |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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32-6575-11CONN IC DIP SOCKET ZIF 32POS TIN |
0 |
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Ficha técnica |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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517-83-370-19-121111CONN SOCKET PGA 370POS GOLD |
0 |
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Ficha técnica |
517 | Bulk | Active | PGA | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-93-640-61-007000CONN IC SKT DBL |
0 |
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116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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HLS-0515-G-2.100" SCREW MACHINE SOCKET ARRAY |
0 |
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Ficha técnica |
HLS | Bulk | Active | SIP | 75 (5 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
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APH-0428-G-RAPH-0428-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0528-G-RAPH-0528-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
