Disponível 24/7 em
+86 13632816717
Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
111-93-952-61-001000CONN IC SKT DBL |
0 |
|
- |
111 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
64-9508-20CONN IC DIP SOCKET 64POS GOLD |
0 |
|
Ficha técnica |
508 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
64-9508-30CONN IC DIP SOCKET 64POS GOLD |
0 |
|
Ficha técnica |
508 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
550-10-191-18-091101PGA SOLDER TAIL |
0 |
|
Ficha técnica |
550 | Bulk | Active | PGA | 191 (18 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
123-13-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
514-83-321-19-121154CONN SOCKET PGA 321POS GOLD |
0 |
|
Ficha técnica |
514 | Bulk | Active | PGA | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
40-6556-21CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
116-43-652-61-006000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-93-652-61-006000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-43-652-61-001000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
117-93-656-61-005000CONN IC SKT DBL |
0 |
|
- |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
40-6503-21CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0411-G-18.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
Ficha técnica |
HLS | Bulk | Active | SIP | 44 (4 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
40-6503-31CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
110-13-652-61-001000CONN IC SKT DBL |
0 |
|
- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
44-6556-21CONN IC DIP SOCKET 44POS GOLD |
0 |
|
Ficha técnica |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
612-13-964-41-001000SOCKET CARRIER SLDRTL .900 64POS |
0 |
|
Ficha técnica |
612 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
510-93-084-11-045003SKT PGA SOLDRTL |
0 |
|
Ficha técnica |
510 | Tube | Active | PGA | 84 (11 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-93-642-61-008000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
123-13-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
0 |
|
Ficha técnica |
123 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
