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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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4607CONN TRANSIST TO-3 3POS TIN |
0 |
|
Ficha técnica |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
|
4609CONN TRANSIST TO-3 3POS TIN |
0 |
|
Ficha técnica |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
|
822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
0 |
|
Ficha técnica |
- | Tube | Obsolete | QFP | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
382437-1CONN SOCKET SIP 3POS TIN |
0 |
|
Ficha técnica |
Diplomate DL | Tray | Obsolete | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
643644-1CONN SOCKET SIP 12POS TIN |
0 |
|
Ficha técnica |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
643654-1CONN SOCKET SIP 22POS TIN |
0 |
|
Ficha técnica |
Diplomate DL | Tray | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD |
0 |
|
Ficha técnica |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
|
|
4618CONN TRANSIST TO-3 3POS TIN |
0 |
|
Ficha técnica |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
|
|
101-93-314-41-560000CONN IC DIP SOCKET 14POS GOLD |
0 |
|
Ficha técnica |
101 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
101-93-640-41-560000CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Ficha técnica |
101 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
518-93-391-18-096002CONN SOCKET PGA 391POS GOLD |
0 |
|
Ficha técnica |
518 | Tube | Active | PGA | 391 (18 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
518-93-447-20-116002SOCKET INTERSTITIAL 447-PGA |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 447 (20 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
1825093-2CONN IC DIP SOCKET 8POS GOLD |
0 |
|
Ficha técnica |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
A-CCS-044-Z-SM-RCONN SOCKET PLCC 44POS TIN |
0 |
|
Ficha técnica |
- | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
A-CCS68-Z-SM-RCONN SOCKET PLCC 68POS TIN |
0 |
|
Ficha técnica |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
940-44-052-17-400000CONN SOCKET PLCC 52POS TIN |
0 |
|
Ficha técnica |
940 | Tube | Discontinued | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
1-390261-9CONN IC DIP SOCKET 28POS TIN |
0 |
|
Ficha técnica |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
|
1-822473-4CONN SOCKET PLCC 44POS TIN |
0 |
|
Ficha técnica |
- | Box | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic | - |
|
1825093-3CONN IC DIP SOCKET 14POS GOLD |
0 |
|
Ficha técnica |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
1825093-4CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Ficha técnica |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
