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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Composição | Diâmetro | Ponto de Fusão | Tipo de Fluxo | Medidor de Fio | Tipo de malha | Processo | Forma | Vida útil | Início da vida útil | Temperatura de armazenamento/refrigeração |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250G |
13 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250G |
6 |
|
Ficha técnica |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391SNL250THERMALLY STABLE SOLDER PASTE NO |
12 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDLTLFP250T3SOLDER PASTE SN42/BI58 250G |
4 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDLTLFP250T4SOLDER PASTE LOW TEMP T4 250G |
6 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LT250THERMALLY STABLE SOLDER PASTE NO |
18 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
NCSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
8 |
|
Ficha técnica |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
24-6337-6401SOLDER WATER SOLUABLE 24AWG 1LB |
21 |
|
Ficha técnica |
331 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD291AX250T5SOLDER PASTE SN63/PB37 250G T5 |
15 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
24-6040-9713SOLDER FLUX-CORED/285 .031" 1LB |
19 |
|
Ficha técnica |
285 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD4300AX250T5SOLDER PASTE SN63/PB37 250G T5 |
14 |
|
Ficha técnica |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
91-7482-3340INNOLOT 2.2%/278 .040 250 G ROBO |
24 |
|
Ficha técnica |
- | Box | Active | Wire Solder | - | 0.040" (1.02mm) | - | No-Clean | - | - | Lead Free | Spool | - | - | - |
|
24-6040-0010SOLDER RA 60/40 24AWG 1LB |
16 |
|
Ficha técnica |
44 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD291SNL250T5SOLDER PASTE SAC305 250G T5 |
6 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
WS991SNL500T4SOLDER PASTE THERMALLY STABLE WS |
10 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
TS991SNL500T4SOLDER PASTE THERMALLY STABLE NC |
9 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
70-4825-0904NP560 SN96.5AG3.0CU0.5 T4 100 GM |
12 |
|
Ficha técnica |
NP560 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Syringe, 3.53 oz (100g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
24-7150-8800SOLDER FLUX-CORED/245 .031" 1LB |
12 |
|
Ficha técnica |
245 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
70-1002-0510SOLDER 500G JAR, SN63/PB37 |
15 |
|
Ficha técnica |
HydroMark 531 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
1993881LOCTITEGC10SAC305T4 885 52U 500g |
23 |
|
Ficha técnica |
LOCTITE® GC 10 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) |
