Disponível 24/7 em
+86 13632816717
Solda
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Composição | Diâmetro | Ponto de Fusão | Tipo de Fluxo | Medidor de Fio | Tipo de malha | Processo | Forma | Vida útil | Início da vida útil | Temperatura de armazenamento/refrigeração |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDLTLFP50T6SOLDER PASTE IN JAR 50G (T6) SN4 |
4 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | 280°F (138°C) | No-Clean | - | - | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
SMDAU80SN20-3INCH-0.762MMSOLDER WIRE (AU80/SN20) GOLD/TIN |
16 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Au80Sn20 (80/20) | 0.030" (0.76mm) | 526°F (280°C) | - | - | - | Lead Free | Spool | 60 Months | - | - |
|
49500WS-454GSOLDER WIRE WS 3.3% FLUX CORE 0. |
10 |
|
Ficha técnica |
49500 | Spool | Active | Wire Solder | Sn99.5Cu0.5 (99.5/0.5) | 0.032" (0.81mm) | 442°F (228°C) | Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4900P-250GLEAD FREE NO CLEAN SOLDER PASTE |
3 |
|
Ficha técnica |
4900 | Bulk | Active | Solder Paste | SAC305 | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Jar, 8.8 oz (250g) | 24 Months | Date of Manufacture | 39°F ~ 50°F (4°C ~ 10°C) |
|
TS391LT500CTHERMALLY STABLE SOLDER PASTE NO |
2 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
70-0102-0611SOLDER PASTE NO CLEAN 600GM |
8 |
|
Ficha técnica |
EP256 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-5306-2410NP510-LT HRL1 T4 88% 500G JAR |
10 |
|
- |
NP510 | Bulk | Active | Solder Paste | - | - | 304°F (151°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
SMD291SNL500T5SOLDER PASTE SAC305 500G T5 |
2 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
70-4102-0611SOLDER PASTE NO CLEAN 600GM |
12 |
|
Ficha técnica |
NP545 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
|
SMDSWLF.004 20GLF SOLDER WIRE SN96.5/AG3/CU0.5 |
5 |
|
Ficha técnica |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.004" (0.10mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | - | Spool, 0.7 oz (20g) | 60 Months | Date of Manufacture | - |
|
70-4021-0811SOLDER PASTE NO CLEAN 600GM |
11 |
|
Ficha técnica |
NP505-HR | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-1903-0810SOLDER 500G JAR,SN96.5 AG3.0 |
6 |
|
Ficha técnica |
R520A | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-5426-2410NP505-HR INNOLOT T4 88.2% 500G J |
5 |
|
Ficha técnica |
NP505-HR | Bulk | Active | Solder Paste | - | - | - | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
|
70-5426-2411NP505-HR INNOLOT T4 88.2% 600G C |
3 |
|
Ficha técnica |
NP505-HR | Bulk | Active | Solder Paste | - | - | - | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
SMDSW.031 2OZSOLDER WIRE NO-CLEAN 63/37 2OZ. |
9 |
|
Ficha técnica |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - | - |
|
NCSWLF.015 0.2OZLF SOLDER WIRE MINI POCKET PACK |
85 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Tube, 0.2 oz (5.66g) | - | - | - |
|
NC2SWLF.015 1OZLF SOLDER WIRE 99.3/0.7 TIN/COPP |
15 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | - | - | Spool, 1 oz (28.35g) | - | - | - |
|
WBRASAC31-2OZWIRE SOLDER , ROSIN ACTIVATED, S |
7 |
|
Ficha técnica |
- | Box | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
WBRA633731-4OZWIRE SOLDER , ROSIN ACTIVATED, 6 |
27 |
|
Ficha técnica |
- | Box | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | - | - | Leaded | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture | - |
|
WBRA633720-4OZWIRE SOLDER , ROSIN ACTIVATED, 6 |
23 |
|
Ficha técnica |
- | Box | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | - | - | Leaded | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture | - |
