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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Composição | Diâmetro | Ponto de Fusão | Tipo de Fluxo | Medidor de Fio | Tipo de malha | Processo | Forma | Vida útil | Início da vida útil | Temperatura de armazenamento/refrigeração |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LT35SMOOTH FLOW LOW TEMP SOLDER PAST |
4 |
|
Ficha técnica |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2170-25000SOLDER SPHERES SN63/PB37 .014" ( |
4 |
|
Ficha técnica |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SMD2150-25000SOLDER SPHERES SN63/PB37 .010" ( |
3 |
|
Ficha técnica |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SSLTNC-50GLOW TEMPERATURE LEAD FREE SOLDER |
2 |
|
Ficha técnica |
- | Bag | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2055-25000SOLDER SPHERES SAC305 DIAMETER 2 |
2 |
|
Ficha técnica |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2050-25000SOLDER SPHERES SAC305 .024" DIAM |
0 |
|
Ficha técnica |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024" (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD4300AX10SOLDER PASTE WATER SOL 10CC |
2 |
|
Ficha técnica |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA35T5SMOOTH FLOW LOW TEMP SOLDER PAST |
1 |
|
Ficha técnica |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291AX10T4SLDR PST NO-CLEAN 63/37 T4 10CC |
4 |
|
Ficha técnica |
- | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191AX50T5SMOOTH FLOW LEADED SOLDER PASTE |
2 |
|
Ficha técnica |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SWLF.031 4OZLF SOLDER WIRE 99.3/0.7 TIN/COPP |
1 |
|
Ficha técnica |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMDAL50ALUMINUM SOLDER PASTE WATER-SOLU |
3 |
|
Ficha técnica |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SWLF.020 4OZLF SOLDER WIRE 99.3/0.7 TIN/COPP |
5 |
|
Ficha técnica |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMDLTLFP10T4SOLDER PASTE LOW TEMP T4 10CC |
5 |
|
Ficha técnica |
- | Dispenser | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLT.047 2OZSOLDER WIRE SN42/BI57/AG1 .047" |
5 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
CQ100GE 35GGERMANIUM DOPED SOLDER PASTE NO- |
5 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291AX10T5SOLDER PASTE NO CLEAN T5 10CC |
4 |
|
Ficha técnica |
- | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300AX10T5SOLDER PASTE WATER SOL T5 10CC |
0 |
|
Ficha técnica |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.031 4OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
5 |
|
Ficha técnica |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
|
NC191SNL35T5SMOOTH FLOW LEAD-FREE SOLDER PAS |
4 |
|
Ficha técnica |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
