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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Composição | Diâmetro | Ponto de Fusão | Tipo de Fluxo | Medidor de Fio | Tipo de malha | Processo | Forma | Vida útil | Início da vida útil | Temperatura de armazenamento/refrigeração |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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REM32-ULTRA-NLULTRA LOW TEMP FLUX CORED CHIP R |
1 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | - | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
2041006LOCTITE GC 3W SAC305T3 895V 53U |
0 |
|
Ficha técnica |
LOCTITE® GC 3W | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) |
|
WBRASAC20-2OZWIRE SOLDER , ROSIN ACTIVATED, S |
2 |
|
Ficha técnica |
- | Box | Active | Wire Solder | - | 0.020" (0.51mm) | - | Rosin Activated (RA) | - | - | - | Spool, 2 oz (56.70g) | - | - | - |
|
WBRASAC31-4OZWIRE SOLDER , ROSIN ACTIVATED, S |
1 |
|
Ficha técnica |
- | Box | Active | Wire Solder | - | 0.031" (0.79mm) | - | Rosin Activated (RA) | - | - | - | Spool, 4 oz (113.40g) | - | - | - |
|
WBRASAC20-4OZWIRE SOLDER , ROSIN ACTIVATED, S |
3 |
|
Ficha técnica |
- | Box | Active | Wire Solder | - | 0.020" (0.51mm) | - | Rosin Activated (RA) | - | - | - | Spool, 4 oz (113.40g) | - | - | - |
|
152986CNP OM5100 063 85-3-M04 S10; ALL |
0 |
|
Ficha técnica |
ALPHA® | Box | Active | - | - | - | - | - | - | - | - | - | 6 Months | Date of Manufacture | - |
|
|
721471LOCTITE LF 318 97SCAGS885V 600G |
0 |
|
Ficha técnica |
LF318 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
2472657LOCTITE GC 18 SAC305T3 885V 53U |
0 |
|
Ficha técnica |
LOCTITE® GC 18 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | - | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) |
|
SSLTNC-10G-SQLOW TEMPERATURE LEAD FREE SOLDER |
10 |
|
Ficha técnica |
- | Bag | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 3 | Lead Free | Bag, 0.35 oz (10g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
SMD-SC-SN18PB82-0.031-1OZSN18/PB82 .031" SOLDER WIRE 1OZ |
0 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Sn18Pb82 (18/82) | 0.031" (0.79mm) | 361°F ~ 540°F (183°C ~ 282°C) | - | - | - | Leaded | Spool, 1 oz (28.35g) | 60 Months | Date of Manufacture | - |
|
|
SMD-SC-SN50PB50-0.031-1OZSN50/PB50 .031" SOLDER WIRE 1OZ |
0 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Sn50Pb50 (50/50) | 0.031" (0.79mm) | 361°F ~ 414°F (183°C ~ 212°C) | - | - | - | Leaded | Spool, 1 oz (28.35g) | 60 Months | Date of Manufacture | - |
|
|
SMD-SC-SN81BI19-0.031-1OZSN81/BI19 .031" SOLDER WIRE 1OZ |
0 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Sn81Bi19 (81/19) | 0.031" (0.79mm) | 280°F ~ 401°F (138°C ~ 205°C) | - | - | - | Lead Free | Spool, 0.035 oz (1g) | 60 Months | Date of Manufacture | - |
|
|
SMD-SC-SN99AG1-0.031-1OZSN99/AG1 .031" SOLDER WIRE 1OZ S |
0 |
|
Ficha técnica |
SMD | Bulk | Active | Wire Solder | Sn99Ag1 (99/1) | 0.031" (0.79mm) | 428°F ~ 446°F (220°C ~ 230°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | 60 Months | Date of Manufacture | - |
|
|
WWSWLT.040 10GSN42/BI57/AG1 2.5% NO-CLEAN WATE |
0 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.35 oz (10g) | 60 Months | Date of Manufacture | - |
|
CQ100GEGERMANIUM DOPED SUPER LOW DROSS |
1 |
|
Ficha técnica |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
|
WWSWLT.040 20GSN42/BI57/AG1 2.5% NO-CLEAN WATE |
0 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.7 oz (20g) | 60 Months | Date of Manufacture | - |
|
|
NCSW.015 1LBSOLDER WIRE 63/37 TIN/LEAD (SN63 |
0 |
|
Ficha técnica |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | - | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | - |
|
SMD291AX500T3SOLDER PASTE SN63/PB37 500G |
1 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2215SOLDER SPHERES 63/37 .030 DIAM |
1 |
|
Ficha técnica |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030" (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SSLFNC-T5-250GSAC 305 LEAD FREE SOLDER PASTE T |
1 |
|
Ficha técnica |
- | Bag | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
