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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Composição | Diâmetro | Ponto de Fusão | Tipo de Fluxo | Medidor de Fio | Tipo de malha | Processo | Forma | Vida útil | Início da vida útil | Temperatura de armazenamento/refrigeração |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMDLTLFP500T4CSOLDER PASTE LOW TEMP T4 500G |
0 |
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Ficha técnica |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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70-1003-0611SOLDER PASTE WATER SOLUBLE 600GM |
0 |
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Ficha técnica |
HydroMark 531 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-4021-0810SOLDER PASTE NO CLEAN 500GM |
0 |
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Ficha técnica |
NP505-HR | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0202-0611SOLDER PASTE NO CLEAN 600GM |
0 |
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Ficha técnica |
EP256HA | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-1002-0310SOLDER PASTE WATER SOLUBLE 500GM |
0 |
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Ficha técnica |
HydroMark 531 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-2102-0310SOLDER PASTE WATER SOLUBLE 500GM |
0 |
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Ficha técnica |
R562 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0605-0810SOLDER PASTE NO CLEAN 500GM |
0 |
|
Ficha técnica |
EM907 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0102-0310SOLDER PASTE NO CLEAN 500GM |
0 |
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Ficha técnica |
EP256 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-2002-0510SOLDERPASTE WATER SOLUABLE 500GM |
0 |
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Ficha técnica |
R560 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0202-0310SOLDER PASTE NO CLEAN 500GM |
0 |
|
Ficha técnica |
EP256 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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24-7050-7402SOLDER FLUX-CORED/282 .031" 1LB |
0 |
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Ficha técnica |
282 | Bulk | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
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70-4105-0811SOLDER PASTE NO CLEAN 600GM |
0 |
|
Ficha técnica |
NP545 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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26-6040-0061SOLDER FLUX-CORED/44 .062" 5LB S |
0 |
|
Ficha técnica |
44 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-0403-0910SOLDER PASTE WATER SOLUBLE 500GM |
0 |
|
Ficha técnica |
EnviroMark™ 828 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0403-0923SOLDER PASTE WATER SOLUBLE 500GM |
0 |
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Ficha técnica |
EnviroMark™ 828 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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SMD291AX500T5SOLDER PASTE SN63/PB37 500G T5 |
0 |
|
Ficha técnica |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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70-0102-0410SOLDER PASTE NO CLEAN 500GM |
0 |
|
Ficha técnica |
EP256 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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26-6040-0053SOLDER FLUX-CORED/44 .050" 5LB S |
0 |
|
Ficha técnica |
44 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-6337-0001SOLDER FLUX-CORED/44 63/37 .010" |
0 |
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Ficha técnica |
44 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | Rosin Activated (RA) | 30 AWG, 33 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-6337-8810SOLDER FLUX-CORED/245 63/37 .010 |
0 |
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Ficha técnica |
245 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
