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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
122-13-314-41-001000

122-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
122-13-314-41-001000

Ficha técnica

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
18-0511-11

18-0511-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0
RFQ
18-0511-11

Ficha técnica

511 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
614-93-424-31-012000

614-93-424-31-012000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.

0
RFQ
614-93-424-31-012000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-424-31-012000

614-43-424-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-424-31-012000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-149-31-018000

714-43-149-31-018000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-149-31-018000

Ficha técnica

714 Bulk Active SIP 49 (1 x 49) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-605000

110-93-640-41-605000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
110-93-640-41-605000

Ficha técnica

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-640-41-605000

110-43-640-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-43-640-41-605000

Ficha técnica

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0532-T-R

APH-0532-T-R

APH-0532-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1532-T-R

APH-1532-T-R

APH-1532-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0232-T-R

APH-0232-T-R

APH-0232-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1332-T-R

APH-1332-T-R

APH-1332-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0832-T-R

APH-0832-T-R

APH-0832-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0332-T-R

APH-0332-T-R

APH-0332-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0732-T-R

APH-0732-T-R

APH-0732-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-91-952-41-001000

110-91-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
110-91-952-41-001000

Ficha técnica

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-952-41-001000

110-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-41-952-41-001000

Ficha técnica

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-11-314-41-001000

123-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-11-314-41-001000

Ficha técnica

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-324-31-002000

614-43-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-324-31-002000

Ficha técnica

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-424-31-002000

614-43-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-424-31-002000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-624-31-002000

614-43-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-624-31-002000

Ficha técnica

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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