Por favor, contacte-nos para obter os preços mais recentes e a quantidade disponível.

Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
614-93-324-31-002000

614-93-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-93-324-31-002000

Ficha técnica

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-424-31-002000

614-93-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-93-424-31-002000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-624-31-002000

614-93-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-93-624-31-002000

Ficha técnica

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-163-41-013000

346-93-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
346-93-163-41-013000

Ficha técnica

346 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-163-41-013000

346-43-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
346-43-163-41-013000

Ficha técnica

346 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0807-T-2

HLS-0807-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0807-T-2

Ficha técnica

HLS Bulk Active SIP 56 (8 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-93-320-41-001000

116-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-320-41-001000

Ficha técnica

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-420-41-001000

116-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-420-41-001000

Ficha técnica

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-320-41-001000

116-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-43-320-41-001000

Ficha técnica

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-420-41-001000

116-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-43-420-41-001000

Ficha técnica

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-289-17-000101

510-83-289-17-000101

CONN SOCKET PGA 289POS GOLD

Preci-Dip

0
RFQ
510-83-289-17-000101

Ficha técnica

510 Bulk Active PGA 289 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-93-324-31-007000

614-93-324-31-007000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.

0
RFQ
614-93-324-31-007000

Ficha técnica

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-424-31-007000

614-93-424-31-007000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.

0
RFQ
614-93-424-31-007000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-624-31-007000

614-93-624-31-007000

SOCKET CARRIER LOWPRO .600 24POS

Mill-Max Manufacturing Corp.

0
RFQ
614-93-624-31-007000

Ficha técnica

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-324-31-007000

614-43-324-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-324-31-007000

Ficha técnica

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-424-31-007000

614-43-424-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-424-31-007000

Ficha técnica

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-624-31-007000

614-43-624-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-43-624-31-007000

Ficha técnica

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-83-120-13-061117

514-83-120-13-061117

CONN SOCKET PGA 120POS GOLD

Preci-Dip

0
RFQ
514-83-120-13-061117

Ficha técnica

514 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
19-0503-21

19-0503-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0
RFQ
19-0503-21

Ficha técnica

0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
19-0503-31

19-0503-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0
RFQ
19-0503-31

Ficha técnica

0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
Total 19086 Record«Prev1... 618619620621622623624625...955Next»

Comece agora!

Obtenha as últimas notícias

EASTECH Electronics

Início

EASTECH Electronics

Pesquisar

EASTECH Electronics

Produtos

EASTECH Electronics

Whatsapp

Enviando...
×
Enviado com sucesso!
Obrigado pelo seu envio, nossa equipe de vendas receberá sua solicitação e entraremos em contato dentro de 12 horas com uma cotação.
OK