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    Pesquisas Populares BF24TFREDUPS M378A1K43CB2-CTD 900-5G132-2240-000 MMF404326 CONNECTOR-GX12-4 900-5G132-2560-000 900-5G190-2570-000 900-5G132-2260-000 FT100-950 9,5/4,8 tr 2101504-1
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    Início > Produtos  > Conectores, Interconexões > Soquetes para CIs, Transistores > Soquetes de CI

    Soquetes de CI

    Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
    40-0508-21

    40-0508-21

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-0508-21

    Ficha técnica

         		508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    40-0508-31

    40-0508-31

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-0508-31

    Ficha técnica

         		508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    116-43-422-61-007000

    116-43-422-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-322-61-007000

    116-93-322-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-528-21-121111

    517-87-528-21-121111

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    		 0
    RFQ
    		517-87-528-21-121111

    Ficha técnica

         		517 Bulk Active PGA 528 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-93-964-41-008000

    116-93-964-41-008000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		116-93-964-41-008000

    Ficha técnica

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-964-41-008000

    116-43-964-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		116-43-964-41-008000

    Ficha técnica

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-642-61-003000

    116-43-642-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-424-61-003000

    116-43-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-324-61-003000

    116-93-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-964-41-001000

    614-93-964-41-001000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		614-93-964-41-001000

    Ficha técnica

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-964-41-001000

    614-43-964-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		614-43-964-41-001000

    Ficha técnica

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-652-61-105000

    110-93-652-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-952-61-105000

    110-93-952-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-529-21-121111

    517-87-529-21-121111

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    		 0
    RFQ
    		517-87-529-21-121111

    Ficha técnica

         		517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    111-43-432-61-001000

    111-43-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-632-61-001000

    111-43-632-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-432-61-001000

    111-93-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-632-61-001000

    111-93-632-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1018-G-R

    APH-1018-G-R

    APH-1018-G-R

    Samtec Inc.

    		 0
    RFQ

    -

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