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    Pesquisas Populares M378A1K43CB2-CTD 900-5G132-2240-000 MMF404326 CONNECTOR-GX12-4 900-5G132-2560-000 900-5G190-2570-000 900-5G132-2260-000 FT100-950 9,5/4,8 tr 2101504-1 900-5G132-2540-000
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    Início > Produtos  > Conectores, Interconexões > Soquetes para CIs, Transistores > Soquetes de CI

    Soquetes de CI

    Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
    APH-0218-G-R

    APH-0218-G-R

    APH-0218-G-R

    Samtec Inc.

    		 0
    RFQ

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    APH-1618-G-R

    APH-1618-G-R

    APH-1618-G-R

    Samtec Inc.

    		 0
    RFQ

    -

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    APH-1718-G-R

    APH-1718-G-R

    APH-1718-G-R

    Samtec Inc.

    		 0
    RFQ

    -

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    APH-0318-G-R

    APH-0318-G-R

    APH-0318-G-R

    Samtec Inc.

    		 0
    RFQ

    -

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    550-10-144-15-081101

    550-10-144-15-081101

    PGA SOLDER TAIL

    Preci-Dip

    		 0
    RFQ
    		550-10-144-15-081101

    Ficha técnica

         		550 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-144-12-000101

    550-10-144-12-000101

    PGA SOLDER TAIL

    Preci-Dip

    		 0
    RFQ
    		550-10-144-12-000101

    Ficha técnica

         		550 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-43-628-61-005000

    117-43-628-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-628-61-005000

    117-93-628-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-318-61-008000

    116-43-318-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-61-008000

    116-93-318-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-636-61-007000

    116-43-636-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-636-61-007000

    116-93-636-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-636-61-001000

    115-43-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    326-93-164-41-001000

    326-93-164-41-001000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		326-93-164-41-001000

    Ficha técnica

         		326 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-964-41-001000

    126-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		126-41-964-41-001000

    Ficha técnica

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-964-41-001000

    126-91-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		126-91-964-41-001000

    Ficha técnica

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0820-TT-22

    HLS-0820-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 0
    RFQ
    		HLS-0820-TT-22

    Ficha técnica

         		HLS Bulk Active SIP 160 (8 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    208-PGM17017-10

    208-PGM17017-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 0
    RFQ
    		208-PGM17017-10

    Ficha técnica

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-1424-G-H

    APH-1424-G-H

    APH-1424-G-H

    Samtec Inc.

    		 0
    RFQ

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    APH-1924-G-H

    APH-1924-G-H

    APH-1924-G-H

    Samtec Inc.

    		 0
    RFQ

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