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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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514-83-272M20-001148CONN SOCKET BGA 272POS GOLD |
0 |
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Ficha técnica |
514 | Bulk | Active | BGA | 272 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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210-2599-50-06023M TEXTOOL ZIP STRIP SOCKETS 210 |
0 |
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- |
Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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514-83-299-20-001117CONN SOCKET PGA 299POS GOLD |
0 |
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Ficha técnica |
514 | Bulk | Active | PGA | 299 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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514-87-352M26-001148CONN SOCKET BGA 352POS GOLD |
0 |
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Ficha técnica |
514 | Bulk | Active | BGA | 352 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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192-PGM17043-11HCONN SOCKET PGA GOLD |
0 |
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Ficha técnica |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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550-10-256M20-001152BGA SOLDER TAIL |
0 |
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Ficha técnica |
550 | Bulk | Active | BGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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550-10-256M16-000152BGA SOLDER TAIL |
0 |
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Ficha técnica |
550 | Bulk | Active | BGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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517-83-545-17-000111CONN SOCKET PGA 545POS GOLD |
0 |
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Ficha técnica |
517 | Bulk | Active | PGA | 545 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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546-87-391-18-101147CONN SOCKET PGA 391POS GOLD |
0 |
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Ficha técnica |
546 | Bulk | Active | PGA | 391 (18 x 18) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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510-91-256-16-000001SKT PGA SOLDRTL |
0 |
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Ficha técnica |
510 | Bulk | Active | PGA | 256 (16 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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40-6508-21CONN IC DIP SOCKET 40POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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40-6508-31CONN IC DIP SOCKET 40POS GOLD |
0 |
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Ficha técnica |
508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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514-87-356M26-001148CONN SOCKET BGA 356POS GOLD |
0 |
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Ficha técnica |
514 | Bulk | Active | BGA | 356 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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510-91-241-18-075003SKT PGA SOLDRTL |
0 |
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Ficha técnica |
510 | Bulk | Active | PGA | 241 (18 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-0534-G-TAPH-0534-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1034-G-TAPH-1034-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1434-G-TAPH-1434-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1234-G-TAPH-1234-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0434-G-TAPH-0434-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1634-G-TAPH-1634-G-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
