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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-3570-16CONN IC DIP SOCKET ZIF 24POS |
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Ficha técnica |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
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24-3571-16CONN IC DIP SOCKET ZIF 24POS |
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Ficha técnica |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
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APH-1434-G-HAPH-1434-G-H |
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APH-0534-G-HAPH-0534-G-H |
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APH-0934-G-HAPH-0934-G-H |
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APH-1934-G-HAPH-1934-G-H |
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APH-1134-G-HAPH-1134-G-H |
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APH-0634-G-HAPH-0634-G-H |
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APH-1634-G-HAPH-1634-G-H |
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APH-0334-G-HAPH-0334-G-H |
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APH-1734-G-HAPH-1734-G-H |
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APH-1334-G-HAPH-1334-G-H |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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546-83-325-18-111147CONN SOCKET PGA 325POS GOLD |
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Ficha técnica |
546 | Bulk | Active | PGA | 325 (18 x 18) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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558-10-255M16-001101PGA SOLDER TAIL 1.27MM |
0 |
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Ficha técnica |
558 | Bulk | Active | PGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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550-10-388M26-001166BGA PIN ADAPTER 1.27MM SMD |
0 |
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Ficha técnica |
550 | Bulk | Active | BGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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32-6556-40CONN IC DIP SOCKET 32POS GOLD |
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Ficha técnica |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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558-10-256M20-001101PGA SOLDER TAIL 1.27MM |
0 |
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Ficha técnica |
558 | Bulk | Active | PGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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558-10-256M16-000101PGA SOLDER TAIL 1.27MM |
0 |
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Ficha técnica |
558 | Bulk | Active | PGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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550-10-272M20-001152BGA SOLDER TAIL |
0 |
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Ficha técnica |
550 | Bulk | Active | BGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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APH-0936-G-TAPH-0936-G-T |
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