Por favor, contacte-nos para obter os preços mais recentes e a quantidade disponível.

Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
APH-1436-G-T

APH-1436-G-T

APH-1436-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-T

APH-1536-G-T

APH-1536-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-T

APH-0636-G-T

APH-0636-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0836-G-T

APH-0836-G-T

APH-0836-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1636-G-T

APH-1636-G-T

APH-1636-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
514-83-292M20-001148

514-83-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip

0
RFQ
514-83-292M20-001148

Ficha técnica

514 Bulk Active BGA 292 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-632-G-T

APO-632-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
101-PGM13022-10H

101-PGM13022-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
101-PGM13022-10H

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
546-87-419-19-111147

546-87-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0
RFQ
546-87-419-19-111147

Ficha técnica

546 Bulk Active PGA 419 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
160-PGM14029-40

160-PGM14029-40

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
160-PGM14029-40

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
546-83-321-17-101147

546-83-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0
RFQ
546-83-321-17-101147

Ficha técnica

546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-420-19-111147

546-87-420-19-111147

CONN SOCKET PGA 420POS GOLD

Preci-Dip

0
RFQ
546-87-420-19-111147

Ficha técnica

546 Bulk Active PGA 420 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-93-241-18-075002

510-93-241-18-075002

CONN SOCKET PGA 241POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
510-93-241-18-075002

Ficha técnica

510 Tube Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
60-9503-21

60-9503-21

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0
RFQ
60-9503-21

Ficha técnica

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
60-9503-31

60-9503-31

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0
RFQ
60-9503-31

Ficha técnica

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
100-PGM10001-51

100-PGM10001-51

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
100-PGM10001-51

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
108-PGM12005-41

108-PGM12005-41

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
108-PGM12005-41

Ficha técnica

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
52-536-11

52-536-11

CONN SOCKET PLCC ZIF 52POS GOLD

Aries Electronics

0
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
32-536-11

32-536-11

CONN SOCKET PLCC ZIF 32POS GOLD

Aries Electronics

0
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
APH-1834-G-R

APH-1834-G-R

APH-1834-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
Total 19086 Record«Prev1... 870871872873874875876877...955Next»

Comece agora!

Obtenha as últimas notícias

EASTECH Electronics

Início

EASTECH Electronics

Pesquisar

EASTECH Electronics

Produtos

EASTECH Electronics

Whatsapp

Enviando...
×
Enviado com sucesso!
Obrigado pelo seu envio, nossa equipe de vendas receberá sua solicitação e entraremos em contato dentro de 12 horas com uma cotação.
OK