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Soquetes de CI
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Número de posições ou pinos (grade) | Passo - Acoplamento | Acabamento do contato - Acoplamento | Espessura do Acabamento de Contato - Acoplamento | Material de Contato - Acoplamento | Tipo de montagem | Recursos | Terminação | Passo - Poste | Acabamento de Contato - Poste | Espessura do Acabamento de Contato - Poste | Material de Contato - Poste | Material do invólucro | Temperatura operacional |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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518-77-357M19-001105CONN SOCKET PGA 357POS GOLD |
0 |
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Ficha técnica |
518 | Bulk | Active | PGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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110-33-628-41-530000CONN IC DIP SOCKET 28POS GOLD |
0 |
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- |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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210-33-628-41-101000SOCKET IC CLOSED FRM .300 28POS |
0 |
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- |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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210-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
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Ficha técnica |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
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110-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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36-3551-16CONN IC DIP SOCKET ZIF 36POS |
0 |
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Ficha técnica |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
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558-10-360M19-001104BGA SURFACE MOUNT 1.27MM |
0 |
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Ficha técnica |
558 | Bulk | Active | BGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
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518-77-352M26-001106CONN SOCKET PGA 352POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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1109042537 ZIF TEST SCKT LIVE BUG TYPE |
0 |
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Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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514-83-432M31-001148CONN SOCKET BGA 432POS GOLD |
0 |
|
Ficha técnica |
514 | Bulk | Active | BGA | 432 (31 x 31) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-360M19-001105CONN SOCKET PGA 360POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
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514-87-560M33-001148CONN SOCKET BGA 560POS GOLD |
0 |
|
Ficha técnica |
514 | Bulk | Active | BGA | 560 (33 x 33) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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210-33-320-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
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- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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518-77-356M26-001106CONN SOCKET PGA 356POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
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281-PGM18037-11CONN SOCKET PGA GOLD |
0 |
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Ficha técnica |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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210-33-632-41-101000CONN IC SKT DBL |
0 |
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Ficha técnica |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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110-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
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- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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210-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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518-77-357M19-001106CONN SOCKET PGA 357POS GOLD |
0 |
|
Ficha técnica |
518 | Bulk | Active | PGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-388M26-001101PGA SOLDER TAIL 1.27MM |
0 |
|
Ficha técnica |
558 | Bulk | Active | PGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
