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Soquetes de CI

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Número de posições ou pinos (grade) Passo - Acoplamento Acabamento do contato - Acoplamento Espessura do Acabamento de Contato - Acoplamento Material de Contato - Acoplamento Tipo de montagem Recursos Terminação Passo - Poste Acabamento de Contato - Poste Espessura do Acabamento de Contato - Poste Material de Contato - Poste Material do invólucro Temperatura operacional
181-PLS18041-12

181-PLS18041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
181-PLS18041-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
181-PRS18040-12

181-PRS18040-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
181-PRS18040-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
181-PRS18041-12

181-PRS18041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
181-PRS18041-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
40-6554-18

40-6554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

0
RFQ
40-6554-18

Ficha técnica

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-3554-18

40-3554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

0
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
196-PRS14001-16

196-PRS14001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
196-PRS14001-16

Ficha técnica

PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
281-PRS19010-12

281-PRS19010-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
281-PRS19010-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
281-PLS19029-12

281-PLS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
281-PLS19029-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
281-PRS19029-12

281-PRS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
281-PRS19029-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
229-PLS16014-12

229-PLS16014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
229-PLS16014-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
229-PRS16014-12

229-PRS16014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
229-PRS16014-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
264-4205-00

264-4205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

0
RFQ

-

Textool™ Box Active - - - - - - - - - - - - - - -
208-PRS17017-12

208-PRS17017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
208-PRS17017-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
28-6554-18

28-6554-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0
RFQ
28-6554-18

Ficha técnica

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
256-PRS16001-12

256-PRS16001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
256-PRS16001-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PRS21011-12

257-PRS21011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
257-PRS21011-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PRS21015-12

257-PRS21015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
257-PRS21015-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PRS20018-12

257-PRS20018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
257-PRS20018-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
262-PLS20003-12

262-PLS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
262-PLS20003-12

Ficha técnica

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
262-PRS20003-12

262-PRS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
262-PRS20003-12

Ficha técnica

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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