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Dissipadores de Calor
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Pacote resfriado | Método de fixação | Forma | Comprimento | Largura | Diâmetro | Altura da aleta | Dissipação de energia @ Aumento de temperatura | Resistência térmica @ Fluxo de ar forçado | Resistência térmica @ Natural | Material | Acabamento do material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AH10928V07500IEALUMINUM EXTRUSION 7.5" |
54 |
|
Ficha técnica |
HS | Box | Active | Board Level, Vertical, Extrusion | Aluminum Housed Resistor | Bolt On | Rectangular, Fins | 7.500" (190.50mm) | 9.750" (247.65mm) | - | 2.280" (57.91mm) | - | - | - | Aluminum Alloy | Unfinished |
|
ATS-EXL117-300-R0PCIE EXTRUSION PROFILE, AL6063 |
125 |
|
Ficha técnica |
- | Bulk | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 11.811" (300.00mm) | 9.213" (234.00mm) | - | 0.492" (12.50mm) | - | 1.10°C/W @ 200 LFM | 6.90°C/W | Aluminum | Degreased |
|
122263HEATSINK 16681 PROFILE 12" |
52 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | Power Modules | Adhesive | Rectangular, Fins | 12.000" (304.80mm) | 8.400" (213.36mm) | - | 1.400" (35.56mm) | - | - | - | Aluminum | Unfinished |
|
12768510.08" WIDE X 12" FLATBACK HEATS |
46 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 12.000" (304.80mm) | 10.080" (256.03mm) | - | 2.905" (73.79mm) | - | - | 0.13°C/W | Aluminum | - |
|
1254317.343WX36" EXTRUSIO 13454 XX4771 |
67 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 7.343" (186.51mm) | - | 1.312" (33.32mm) | - | - | 0.28°C/W | Aluminum | - |
|
510-14MHEATSINK FOR PWR MOD/IGBT/RELAY |
34 |
|
Ficha técnica |
510 | Bulk | Active | Top Mount, Extrusion | Power Modules | Adhesive | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | - | 3.106" (78.89mm) | - | - | 0.21°C/W | Aluminum | - |
|
ATS-UC-QFLOW-100QUADFLOW HEATSINK 1U AL FINS |
149 |
|
Ficha técnica |
quadFLOW™ | Box | Active | Top Mount, Zipper Fin | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin | Square, Fins | 3.637" (92.38mm) | 3.626" (92.11mm) | - | 1.142" (29.00mm) | - | - | - | Aluminum | Nickel |
|
12768812.203" WIDE X 12" FLATBACK HEAT |
56 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 12.000" (304.80mm) | 12.203" (309.96mm) | - | 2.870" (72.90mm) | - | - | 0.18°C/W | Aluminum | - |
|
ATS-UC-DFLOW-200DUALFLOW HEATSINK 1U CU FINS |
88 |
|
Ficha técnica |
dualFLOW™ | Box | Active | Top Mount, Zipper Fin | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin | Square, Fins | 3.637" (92.38mm) | 3.626" (92.11mm) | - | 1.142" (29.00mm) | - | - | - | Copper | Nickel |
|
1256578.40WX36" EXTRUSION 16681 |
26 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 8.400" (213.36mm) | - | 1.400" (35.56mm) | - | - | - | Aluminum | - |
|
ATS-EXL77-1220-R0HEATSINK AL6063 1220X120.75X16.6 |
29 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 48.032" (1220.00mm) | 4.754" (120.75mm) | - | 0.654" (16.60mm) | - | 1.00°C/W @ 200 LFM | 12.00°C/W | Aluminum | Degreased |
|
|
ATS-UC-QFLOW-VC-200QUADFLOW HEATSINK 1U VAPOR |
82 |
|
Ficha técnica |
quadFLOW™ | Box | Active | Top Mount, Zipper Fin | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin | Square, Fins | 3.637" (92.38mm) | 3.626" (92.11mm) | - | 1.142" (29.00mm) | - | - | - | Copper | Nickel |
|
12562511.811WX12" EXTRUSION 19740 |
43 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 12.000" (304.80mm) | 11.811" (300.00mm) | - | 3.287" (83.49mm) | - | - | 0.12°C/W | Aluminum | - |
|
1277977.62" WIDE X 36" FLATBACK W/MOUN |
117 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Bolt On | Rectangular, Fins | 36.000" (914.40mm) | 7.620" (193.55mm) | - | 3.075" (78.11mm) | - | - | 0.17°C/W | Aluminum | - |
|
|
ATS-EXL117-1220-R0PCIE EXTRUSION PROFILE, AL6063 |
30 |
|
Ficha técnica |
- | Bulk | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 48.032" (1220.00mm) | 9.213" (234.00mm) | - | 0.492" (12.50mm) | - | 1.10°C/W @ 200 LFM | 6.90°C/W | Aluminum | Degreased |
|
ATS-PCB1065HEATSINK TO-220 CLIP-ON BLACK |
1,555 |
|
Ficha técnica |
- | Bulk | Active | Board Level | TO-220 | Clip | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Aluminum | Black Anodized |
|
HSS-B20-065V-02HEATSINK TO-220 2.9W ALUMINUM |
1,211 |
|
Ficha técnica |
HSS | Bag | Active | Board Level | TO-220 | PC Pin | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Aluminum | Black Anodized |
|
ATS-PCB1024HEATSINK TO-220 BLACK |
2,581 |
|
Ficha técnica |
- | Bulk | Active | Board Level | TO-220 | Bolt On | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | - | 11.00°C/W @ 200 LFM | 16.70°C/W | Aluminum | Black Anodized |
|
HSS-B20-0953H-02HEATSINK TO-220 2.9W ALUMINUM |
2,197 |
|
Ficha técnica |
HSS | Bag | Active | Board Level, Vertical | TO-220 | PC Pin | Rectangular, Fins | 0.500" (12.70mm) | 0.504" (12.80mm) | - | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Aluminum | Black Anodized |
|
HSS-B20-061H-02HEATSINK TO-220 2.9W ALUMINUM |
2,578 |
|
Ficha técnica |
HSS | Bag | Active | Board Level, Vertical | TO-220 | PC Pin | Rectangular, Fins | 0.500" (12.70mm) | 0.504" (12.80mm) | - | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Aluminum | Black Anodized |
