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Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
507302B00000G

507302B00000G

HEATSINK TO-220 2.5W LOW PROFILE

Boyd Laconia, LLC

31,204
RFQ
507302B00000G

Ficha técnica

- Bulk Active Board Level TO-220 Bolt On Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
574502B00000G

574502B00000G

HEATSINK TO-220 VERT MNT .75"

Boyd Laconia, LLC

39,642
RFQ
574502B00000G

Ficha técnica

- Bag Active Board Level TO-220 Clip Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
290-1AB

290-1AB

HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette

4,488
RFQ
290-1AB

Ficha técnica

290 Bulk Active Board Level TO-218, TO-202, TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
V-1100-SMD/B-L

V-1100-SMD/B-L

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

6,405
RFQ
V-1100-SMD/B-L

Ficha técnica

- Bulk Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
V-1100-SMD/A-L

V-1100-SMD/A-L

HEATSINK TO-263 12.70X26.20MM

Assmann WSW Components

4,987
RFQ
V-1100-SMD/A-L

Ficha técnica

- Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
577102B04000G

577102B04000G

HEATSINK TO-220 W/TAB .375"

Boyd Laconia, LLC

21,002
RFQ
577102B04000G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 25.90°C/W Aluminum Black Anodized
V2017B

V2017B

HEATSINK ANOD ALUM CPU

Assmann WSW Components

3,057
RFQ
V2017B

Ficha técnica

- Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) - Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) - - 31.00°C/W Aluminum Black Anodized
V6560W

V6560W

HEATSINK ALUM ANOD

Assmann WSW Components

4,885
RFQ
V6560W

Ficha técnica

- Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 10.00°C/W Aluminum Black Anodized
V-1100-SMD/B

V-1100-SMD/B

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

14,896
RFQ
V-1100-SMD/B

Ficha técnica

- Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
287-1ABE

287-1ABE

HEATSINK FOR TO220

Wakefield-Vette

3,947
RFQ
287-1ABE

Ficha técnica

287 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
577202B00000G

577202B00000G

HEAT SINK TO-220 .500" COMPACT

Boyd Laconia, LLC

11,197
RFQ
577202B00000G

Ficha técnica

- Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
576802B04000G

576802B04000G

HEAT SINK VERT PLUG-IN TO-220

Boyd Laconia, LLC

12,560
RFQ
576802B04000G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
577102B00000G

577102B00000G

HEAT SINK TO-220 .375" COMPACT

Boyd Laconia, LLC

778
RFQ
577102B00000G

Ficha técnica

- Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Aluminum Black Anodized
110991327

110991327

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

22,678
RFQ
110991327

Ficha técnica

- Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
573300D00010G

573300D00010G

HEATSINK D2PAK .4" HIGH SMD

Boyd Laconia, LLC

21,954
RFQ
573300D00010G

Ficha técnica

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Aluminum Tin
658-25AB

658-25AB

HEATSINK CPU 28MM SQ BLK

Wakefield-Vette

10,734
RFQ
658-25AB

Ficha técnica

658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
HSB05-171711

HSB05-171711

HEAT SINK, BGA, 17 X 17 X 11.5 M

Same Sky (Formerly CUI Devices)

6,249
RFQ
HSB05-171711

Ficha técnica

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.453" (11.50mm) 3.1W @ 75°C 8.40°C/W @ 200 LFM 23.91°C/W Aluminum Alloy Black Anodized
574502B03300G

574502B03300G

HEATSINK TO-220 VERT MNT W/TAB

Boyd Laconia, LLC

8,221
RFQ
574502B03300G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
658-60AB

658-60AB

HEATSINK CPU 28MM SQ BLK W/OTAPE

Wakefield-Vette

133
RFQ
658-60AB

Ficha técnica

658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
573100D00010G

573100D00010G

HEATSINK SMT D-PAK/TO-252 TIN

Boyd Laconia, LLC

11,190
RFQ
573100D00010G

Ficha técnica

5731 Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 26.00°C/W Aluminum Tin
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