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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Pacote resfriado | Método de fixação | Forma | Comprimento | Largura | Diâmetro | Altura da aleta | Dissipação de energia @ Aumento de temperatura | Resistência térmica @ Fluxo de ar forçado | Resistência térmica @ Natural | Material | Acabamento do material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
513102B02500GHEATSINK TO-220 W/PINS 1.5"TALL |
4,060 |
|
Ficha técnica |
- | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Aluminum | Black Anodized |
|
3083ALUM HEAT SINK FOR RASPBERRY PI |
2,534 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | Raspberry Pi 3 | Thermal Tape, Adhesive (Included) | Square, Fins | 0.551" (14.00mm) | 0.551" (14.00mm) | - | 0.315" (8.00mm) | - | - | - | Aluminum | - |
|
LTN20069HEAT SINK BGA/PGA 16.5X16.5X8.9 |
5,849 |
|
Ficha técnica |
Penguin | Bulk | Active | Board Level | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
513201B02500GHEATSINK TO-218/TO-247 W/PINS 2" |
1,697 |
|
Ficha técnica |
- | Bulk | Active | Board Level, Vertical | TO-218 | Bolt On and PC Pin | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | 2.0W @ 20°C | 3.00°C/W @ 400 LFM | 8.30°C/W | Aluminum | Black Anodized |
|
637-10ABPEHEATSINK TO-220 VERT MT BLK 1" |
2,170 |
|
Ficha técnica |
637 | Box | Active | Board Level, Vertical | TO-220 | Bolt On and Board Mounts | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | 6.0W @ 76°C | 5.80°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
V-1102-SMD/A-LHEATSINK TO-263 19.38X25.40MM |
4,655 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | TO-263 (D²Pak) | SMD Pad | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | - | 23.00°C/W @ 300 LFM | 11.00°C/W | Copper | Tin |
|
DV-T263-201E-TRHEATSINK FOR TO-263 |
10,676 |
|
Ficha técnica |
D | Tape & Reel (TR) | Active | Top Mount | TO-263 (D²Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | Degreased |
|
6025DGHEATSINK TO-220 STAGGEREDFIN TIN |
8,081 |
|
Ficha técnica |
- | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.250" (31.75mm) | 0.875" (22.23mm) | - | 0.250" (6.35mm) | 3.0W @ 60°C | 7.00°C/W @ 400 LFM | 17.90°C/W | Copper | Tin |
|
TGH-0075-01ALUMINIUM HEAT SINK 7.5X7.5MM |
747 |
|
Ficha técnica |
TGH | Bulk | Active | Top Mount | - | - | Square, Fins | 0.295" (7.50mm) | 0.295" (7.50mm) | - | 0.394" (10.00mm) | - | - | - | Aluminum | Clean Anodized |
|
V5618AHEATSINK ALUM ANOD |
24,969 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | 6-Dip and 8-Dip | Press Fit | Rectangular, Fins | 0.334" (8.50mm) | 0.250" (6.35mm) | - | 0.189" (4.80mm) | - | - | 80.00°C/W | Aluminum | Black Anodized |
|
375424B00034GHEATSINK PIN-FIN W/TAPE |
2,277 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | BGA | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.598" (15.19mm) | 0.598" (15.19mm) | - | 0.252" (6.40mm) | - | 17.60°C/W @ 200 LFM | 62.50°C/W | Aluminum | Black Anodized |
|
3082ALUM HEATSINK FOR RASPBERRY PI |
1,139 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | Raspberry Pi 3 | Thermal Tape, Adhesive (Included) | Square, Fins | 0.591" (15.00mm) | 0.591" (15.00mm) | - | 0.590" (15.00mm) | - | - | - | Aluminum | - |
|
110991328HEAT SINK KIT FOR RASPBERRY PI 4 |
2,602 |
|
Ficha técnica |
- | Bulk | Active | Top Mount Kit | Raspberry Pi 4B | Adhesive | - | - | - | - | - | - | - | - | Aluminum | - |
|
374024B00035GHEATSINK BGA 23X23X10MM W/ADH |
1,892 |
|
Ficha técnica |
- | Bulk | Active | Top Mount | BGA | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.906" (23.01mm) | 0.906" (23.01mm) | - | 0.394" (10.00mm) | 1.0W @ 40°C | 11.70°C/W @ 200 LFM | 40.00°C/W | Aluminum | Black Anodized |
|
529702B02500GBOARD LEVEL HEATSINK 1" TO-220 |
2,157 |
|
Ficha técnica |
- | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | 4.0W @ 30°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Aluminum | Black Anodized |
|
|
657-20ABEPHEATSINK TO-220 W/PINS BLK 2" |
9,777 |
|
Ficha técnica |
657 | Bulk | Active | Board Level, Vertical | TO-218, TO-220, TO-247 | Bolt On and PC Pin | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | 2.000" (50.80mm) | 6.0W @ 32°C | 2.90°C/W @ 200 LFM | 5.30°C/W | Aluminum | Black Anodized |
|
647-15ABPEHEATSINK TO-220 W/PINS BLK 1.5" |
3,550 |
|
Ficha técnica |
647 | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | 6.0W @ 37°C | 3.50°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
7109D/TRGHEATSINK TO-263 (D2PK) |
9,031 |
|
Ficha técnica |
- | Tape & Reel (TR) | Active | Top Mount | TO-263 (D²Pak) | SMD Pad | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Copper | Tin |
|
624-25ABT4EHEATSINK CPU 21MM SQ W/DBL TAPE |
1,017 |
|
Ficha técnica |
624 | Bulk | Active | Top Mount | BGA | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
DV-T263-101E-TRTO-263 HEAT SINK / POLY TAPE |
2,480 |
|
Ficha técnica |
D | Tape & Reel (TR) | Active | Top Mount | TO-263 (D²Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | Degreased |
