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Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
SC1148

SC1148

ACTIVE COOLER

Raspberry Pi

775
RFQ

-

- Box Active - - - - - - - - - - - - -
7109DG

7109DG

TOP MOUNT HEATSINK .45" D2PAK

Boyd Laconia, LLC

5,401
RFQ
7109DG

Ficha técnica

- Bag Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
BDN18-3CB/A01

BDN18-3CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

354
RFQ
BDN18-3CB/A01

Ficha técnica

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.355" (9.02mm) - 3.50°C/W @ 400 LFM 10.80°C/W Aluminum Black Anodized
901-19-2-12-2-B-0

901-19-2-12-2-B-0

HEATSINK 19X19X12MM PIN

Wakefield-Vette

2,598
RFQ
901-19-2-12-2-B-0

Ficha técnica

901 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.457" (11.60mm) - 6.60°C/W @ 200 LFM 12.70°C/W Aluminum Black Anodized
APF19-19-06CB/A01

APF19-19-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

839
RFQ
APF19-19-06CB/A01

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.250" (6.35mm) - 7.10°C/W @ 200 LFM - Aluminum Black Anodized
531002B02500G

531002B02500G

HEATSINK TO-220 W/PINS 1" TALL

Boyd Laconia, LLC

584
RFQ
531002B02500G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
APF19-19-10CB/A01

APF19-19-10CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

3,434
RFQ
APF19-19-10CB/A01

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54270D-C1-R0

ATS-54270D-C1-R0

HEAT SINK 27MM X 27MM X 9.5MM

Advanced Thermal Solutions Inc.

2,391
RFQ
ATS-54270D-C1-R0

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) - 14.10°C/W @ 200 LFM - Aluminum Black Anodized
ATS-CPX060060006-205-C2-R0

ATS-CPX060060006-205-C2-R0

HEATSINK 60X60X6MM XCUT CP

Advanced Thermal Solutions Inc.

213
RFQ
ATS-CPX060060006-205-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.236" (6.00mm) - 13.00°C/W @ 100 LFM - Aluminum Blue Anodized
C40-058-AE

C40-058-AE

HEATSINK FOR TO-247 TO-264

Ohmite

1,168
RFQ
C40-058-AE

Ficha técnica

C40 Box Active Board Level, Vertical TO-247, TO-264, SOT-227 Clip and Board Mounts Rectangular, Fins 2.283" (58.00mm) 1.724" (43.79mm) - 1.260" (32.00mm) - - - Aluminum Black Anodized
ATS-P1-138-C2-R0

ATS-P1-138-C2-R0

HEATSINK 25X25X15MM L-TAB T766

Advanced Thermal Solutions Inc.

965
RFQ
ATS-P1-138-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
BDN18-6CB/A01

BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

349
RFQ
BDN18-6CB/A01

Ficha técnica

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.605" (15.37mm) - 2.80°C/W @ 400 LFM 8.10°C/W Aluminum Black Anodized
ATS-TI1OP-521-C1-R1

ATS-TI1OP-521-C1-R1

HEAT SINK FOR TI MOD #TPA3130D

Advanced Thermal Solutions Inc.

9,137
RFQ
ATS-TI1OP-521-C1-R1

Ficha técnica

- Bulk Active Top Mount - Bolt On Rectangular, Fins 1.969" (50.00mm) 0.547" (13.89mm) - 0.984" (25.00mm) - 8.50°C/W @ 200 LFM - Aluminum Black Anodized
593002B03400G

593002B03400G

HEATSINK TWISTED FIN TO-220

Boyd Laconia, LLC

7,169
RFQ
593002B03400G

Ficha técnica

Channel 5900 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
532702B02500G

532702B02500G

HEATSINK TO-220 SOLDERPIN 50.8MM

Boyd Laconia, LLC

484
RFQ
532702B02500G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
ATS-56001-C1-R0

ATS-56001-C1-R0

HEAT SINK 19MM X 19MM X 9MM

Advanced Thermal Solutions Inc.

2,924
RFQ
ATS-56001-C1-R0

Ficha técnica

maxiFLOW Bulk Active Top Mount ASIC Thermal Tape, Adhesive (Included) Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.354" (9.00mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
APF30-30-13CB/A01

APF30-30-13CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

403
RFQ
APF30-30-13CB/A01

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54150D-C1-R0

ATS-54150D-C1-R0

HEAT SINK 15MM X 15MM X 9.5MM

Advanced Thermal Solutions Inc.

1,564
RFQ
ATS-54150D-C1-R0

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
APF40-40-06CB/A01

APF40-40-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

608
RFQ
APF40-40-06CB/A01

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.250" (6.35mm) - 3.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-55170D-C1-R0

ATS-55170D-C1-R0

HEAT SINK 17MM X 17MM X 9.5MM

Advanced Thermal Solutions Inc.

2,059
RFQ
ATS-55170D-C1-R0

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) - 28.00°C/W @ 200 LFM - Aluminum Black Anodized
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