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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
V7466Z HEATSINK ALUM ANOD Assmann WSW Components	1,386	-	RFQ	Ficha técnica	-	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Bolt On and PC Pin	Square, Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.500" (12.70mm)	-	-	5.60°C/W	Aluminum	Black Anodized
634-15ABPE HEATSINK SLIM VERT BLACK TO-220 Wakefield-Vette	2,519	-	RFQ	Ficha técnica	634	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	3.0W @ 50°C	2.00°C/W @ 300 LFM	50.00°C/W	Aluminum	Black Anodized
575200B00000G HEATSINK TO-92 .72" BLK Boyd Laconia, LLC	2,993	-	RFQ	Ficha técnica	-	Bag	Active	Board Level, Vertical	TO-92	Press Fit	Rectangular, Fins	0.602" (15.29mm)	-	-	0.720" (18.29mm)	0.3W @ 20°C	17.50°C/W @ 400 LFM	60.00°C/W	Aluminum	Black Anodized
624-45ABT3 HEATSINK CPU 21MM SQ W/ADH BLK Wakefield-Vette	14,121	-	RFQ	Ficha técnica	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.450" (11.43mm)	-	15.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
574402B03200G HEATSINK TO220 HOR MNT W/TAB.75" Boyd Laconia, LLC	3,374	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level	TO-220	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	3.0W @ 60°C	12.00°C/W @ 200 LFM	23.20°C/W	Aluminum	Black Anodized
RA-T2X-25E HEATSINK TO-218,TO-220,TO-247 Ohmite	330	-	RFQ	Ficha técnica	R	Box	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.654" (42.00mm)	0.985" (25.00mm)	-	1.000" (25.40mm)	2.0W @ 20°C	1.50°C/W @ 200 LFM	4.80°C/W	Aluminum	Black Anodized
531102B02500G HEATSINK TO-220 W/PINS 1.5"TALL Boyd Laconia, LLC	1,329	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	7.0W @ 70°C	3.00°C/W @ 500 LFM	10.40°C/W	Aluminum	Black Anodized
WA-T220-101E HEATSINK AND CLIP FOR TO-220 BLK Ohmite	2,018	-	RFQ	Ficha técnica	W	Tray	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	1.201" (30.50mm)	0.720" (18.29mm)	-	0.630" (16.00mm)	1.0W @ 20°C	-	12.00°C/W	Aluminum	Black Anodized
529901B02500G HEATSINK TO-218 SOLDER PIN Boyd Laconia, LLC	225	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	12.0W @ 50°C	1.00°C/W @ 800 LFM	4.50°C/W	Aluminum	Black Anodized
DA-T263-101E-TR TO-263 HEAT SINK / POLY TAPE Ohmite	504	-	RFQ	Ficha técnica	D	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.020" (25.91mm)	-	0.400" (10.16mm)	2.0W @ 30°C	8.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
576802B00000G HEATSINK TO-220 5W BLK Boyd Laconia, LLC	8,323	-	RFQ	Ficha técnica	-	Bag	Active	Board Level	TO-220, TO-262	Clip	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.5W @ 40°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
DA-T263-201E-TR HEATSINK FOR TO-263 Ohmite	1,390	-	RFQ	Ficha técnica	D	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.020" (25.91mm)	-	0.480" (12.19mm)	2.0W @ 30°C	8.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
658-60ABT1E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	16,874	-	RFQ	Ficha técnica	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.600" (15.24mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
BDN09-3CB/A01 HEATSINK CPU W/ADHESIVE .91"SQ CTS Thermal Management Products	3,542	-	RFQ	Ficha técnica	BDN	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.910" (23.11mm)	0.910" (23.11mm)	-	0.355" (9.02mm)	-	9.60°C/W @ 400 LFM	26.90°C/W	Aluminum	Black Anodized
6236BG HEATSINK TO-220 CLIP-ON BLACK Boyd Laconia, LLC	1,440	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Clip	Rectangular, Fins	0.700" (17.78mm)	0.520" (13.21mm)	-	0.510" (12.95mm)	2.0W @ 50°C	12.00°C/W @ 300 LFM	25.00°C/W	Aluminum	Black Anodized
7106DG BOARD LEVEL HEATSINK .375" D2PAK Boyd Laconia, LLC	13,259	-	RFQ	Ficha técnica	-	Bulk	Active	Top Mount	TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10	SMD Pad	Rectangular, Fins	0.591" (15.00mm)	1.020" (25.91mm)	-	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 400 LFM	-	Copper	Tin
BDN10-3CB/A01 HEATSINK CPU W/ADHESIVE 1.01"SQ CTS Thermal Management Products	780	-	RFQ	Ficha técnica	BDN	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.010" (25.65mm)	1.010" (25.65mm)	-	0.355" (9.02mm)	-	8.00°C/W @ 400 LFM	26.40°C/W	Aluminum	Black Anodized
592502B03400G HEATSINK TO-220 VERT MNT W/TABS Boyd Laconia, LLC	14,142	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.874" (22.20mm)	-	0.250" (6.35mm)	1.0W @ 30°C	10.00°C/W @ 200 LFM	22.00°C/W	Aluminum	Black Anodized
322605B00000G HEATSINK TO-5 1.25W H=.25" BLK Boyd Laconia, LLC	1,057	-	RFQ	Ficha técnica	-	Bag	Active	Top Mount	TO-5	Press Fit	Cylindrical	-	-	0.315" (8.00mm) ID, 0.750" (19.05mm) OD	0.250" (6.35mm)	1.0W @ 60°C	25.00°C/W @ 200 LFM	54.00°C/W	Aluminum	Black Anodized
529802B02500G HEATSINK TO-220 W/PINS 1.5"TALL Boyd Laconia, LLC	7,718	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.500" (38.10mm)	10.0W @ 50°C	3.00°C/W @ 200 LFM	3.70°C/W	Aluminum	Black Anodized

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