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Dissipadores de Calor
| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Pacote resfriado | Método de fixação | Forma | Comprimento | Largura | Diâmetro | Altura da aleta | Dissipação de energia @ Aumento de temperatura | Resistência térmica @ Fluxo de ar forçado | Resistência térmica @ Natural | Material | Acabamento do material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATS-X51400K-C1-R0MAXIFLOW 39.25X39.25X14.5MM T766 |
115 |
|
Ficha técnica |
maxiFLOW, superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Angled Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.571" (14.50mm) | - | 2.50°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
|
ATS-X51425K-C1-R0MAXIFLOW 41.75X41.75X14.5MM T766 |
125 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
ATS-X53450R-C1-R0STR FIN 44.25X44.25X19.5MM T766 |
125 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
4-1542005-0HEAT SINK BGA 25MM 7FIN RADIAL |
257 |
|
Ficha técnica |
- | Box | Active | - | BGA | Clip | Cylindrical | - | - | 1.375" (34.92mm) OD | 0.894" (22.71mm) | - | 3.80°C/W @ 200 LFM | 10.50°C/W | Aluminum | Black Anodized |
|
DHS-B10670-04AHEATSINK ASSY LGA2011 NARROW |
288 |
|
Ficha técnica |
- | Box | Not For New Designs | Board Level | LGA | Bolt On | Rectangular, Fins | 4.173" (106.00mm) | 2.756" (70.00mm) | - | 1.004" (25.50mm) | - | - | 0.26°C/W | Aluminum | - |
|
1277915.64" WIDE X 36" MULTI CHANNEL 7 |
154 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 5.640" (143.26mm) | - | 1.000" (25.40mm) | - | - | 0.57°C/W | Aluminum | - |
|
1277615.86" X 36" FLATBACK HEATSINK 14 |
30 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 5.860" (148.84mm) | - | 2.000" (50.80mm) | - | - | 0.28°C/W | Aluminum | - |
|
1277574.461" WIDE X 36" FLATBACK HEATS |
46 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 4.461" (113.31mm) | - | 1.310" (33.27mm) | - | - | 0.45°C/W | Aluminum | - |
|
1276893.375" X 12" H STYLE HEATSINK 17 |
52 |
|
Ficha técnica |
- | Box | Active | Board Level, Extrusion | - | Bolt On | Rectangular, Fins | 12.000" (304.80mm) | 3.750" (95.25mm) | - | 9.000" (228.60mm) | - | - | 0.15°C/W | Aluminum | - |
|
ATS-UC-NF-201CPU HEAT SINK NO FAN COPPER |
105 |
|
Ficha técnica |
- | Box | Active | Top Mount, Skived | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | 1.102" (28.00mm) | - | - | - | Copper | Nickel |
|
ATS-UC-QFLOW-200QUADFLOW HEATSINK 1U CU FINS |
99 |
|
Ficha técnica |
quadFLOW™ | Box | Active | Top Mount, Zipper Fin | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin | Square, Fins | 3.637" (92.38mm) | 3.626" (92.11mm) | - | 1.142" (29.00mm) | - | - | - | Copper | Nickel |
|
12777911.42" WIDE X 36" FLATBACK HEAT |
26 |
|
Ficha técnica |
- | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 11.420" (290.07mm) | - | 2.559" (65.00mm) | - | - | 0.19°C/W | Aluminum | - |
|
262-75ABE375HEATSINK VERT/HORIZ TO-220 |
4,580 |
|
Ficha técnica |
262 | Bulk | Active | Board Level, Vertical | TO-220 | Press Fit and PC Pin | Rectangular, Fins | 0.750" (19.05mm) | 0.570" (14.47mm) | - | 0.500" (12.70mm) | 3.0W @ 80°C | 10.00°C/W @ 200 LFM | 26.70°C/W | Aluminum | Black Anodized |
|
ATS-PCB1032HEATSINK CLIP-ON TO-220 BLK |
2,494 |
|
Ficha técnica |
- | Bulk | Active | Board Level | TO-220 | Bolt On | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | - | 9.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | Black Anodized |
|
|
HSB31-212105HEAT SINK, BGA, 21 X 21 X 5 MM |
1,836 |
|
Ficha técnica |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | 0.197" (5.00mm) | 3.0W @ 75°C | 9.90°C/W @ 200 LFM | 25.33°C/W | Aluminum Alloy | Black Anodized |
|
|
650-BHEATSINK FOR DIPS |
8,889 |
|
Ficha técnica |
650 | Bulk | Active | Top Mount | 14-DIP and 16-DIP | Thermal Tape, Adhesive (Not Included) | Rectangular, Fins | 0.250" (6.35mm) | 0.740" (18.80mm) | - | 0.240" (6.10mm) | 0.5W @ 40°C | 4.00°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
ATS-PCB1033HEATSINK CLIP-ON TO-220 W/TAB |
2,269 |
|
Ficha técnica |
- | Bulk | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | - | 9.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | Black Anodized |
|
V7477YHEATSINK ALUM ANOD |
200 |
|
Ficha técnica |
- | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On and PC Pin | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.500" (12.70mm) | - | - | 9.00°C/W | Aluminum | Black Anodized |
|
|
HSB34-282811HEAT SINK, BGA, 28 X 28 X 11.2 M |
1,105 |
|
Ficha técnica |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 1.102" (28.00mm) | 1.102" (28.00mm) | - | 0.441" (11.20mm) | 5.0W @ 75°C | 5.10°C/W @ 200 LFM | 15.05°C/W | Aluminum Alloy | Black Anodized |
|
|
630-35ABHEATSINK FOR 35MM BGA |
2,831 |
|
Ficha técnica |
630 | Bulk | Active | Top Mount | BGA | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.350" (8.89mm) | - | 5.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
