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Início > Produtos > Ventiladores, Sopradores, Gerenciamento Térmico > Térmico > Dissipadores de Calor

Dissipadores de Calor

Nº da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Série	Embalagem	Status do produto	Tipo	Pacote resfriado	Método de fixação	Forma	Comprimento	Largura	Diâmetro	Altura da aleta	Dissipação de energia @ Aumento de temperatura	Resistência térmica @ Fluxo de ar forçado	Resistência térmica @ Natural	Material	Acabamento do material
625-35AB HEATSINK FOR 25MM BGA Wakefield-Vette	348	-	RFQ	Ficha técnica	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	13.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-10ABPE HEATSINK TO-220 W/PINS BLK 1" Wakefield-Vette	807	-	RFQ	Ficha técnica	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 41°C	3.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
288-1ABE HEATSINK FOR TO220 Wakefield-Vette	3,312	-	RFQ	Ficha técnica	288	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.215" (5.46mm)	4.0W @ 85°C	12.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
HSB32-232318 HEAT SINK, BGA, 23 X 23 X 18 MM, Same Sky (Formerly CUI Devices)	615	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	5.9W @ 75°C	4.40°C/W @ 200 LFM	12.67°C/W	Aluminum Alloy	Black Anodized
628-25AB HEATSINK FOR 45MM BGA Wakefield-Vette	2,991	-	RFQ	Ficha técnica	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.250" (6.35mm)	4.5W @ 80°C	7.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
624-35AB HEATSINK FOR 21MM BGA Wakefield-Vette	5,444	-	RFQ	Ficha técnica	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.350" (8.89mm)	-	15.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSB33-272710 HEAT SINK, BGA, 27 X 27 X 10 MM, Same Sky (Formerly CUI Devices)	1,044	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	4.4W @ 75°C	5.30°C/W @ 200 LFM	17.22°C/W	Aluminum Alloy	Black Anodized
657-20ABPNE HEATSINK TO-220 W/PINS BLK 2" Wakefield-Vette	1,000	-	RFQ	Ficha técnica	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.000" (50.80mm)	6.0W @ 32°C	2.90°C/W @ 200 LFM	-	Aluminum	Black Anodized
659-65AB HEATSINK EXTRUSION 37MM Wakefield-Vette	759	-	RFQ	Ficha técnica	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
624-60AB HEATSINK FOR 21MM BGA Wakefield-Vette	521	-	RFQ	Ficha técnica	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
625-60AB HEATSINK FOR 25MM BGA Wakefield-Vette	329	-	RFQ	Ficha técnica	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.600" (15.24mm)	-	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
628-35AB HEATSINK FOR 45MM BGA Wakefield-Vette	1,997	-	RFQ	Ficha técnica	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
ATS-PCBT1086 HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc.	989	-	RFQ	Ficha técnica	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	9.50°C/W @ 200 LFM	22.00°C/W	Aluminum	Black Anodized
627-15ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	410	-	RFQ	Ficha técnica	627	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	1.500" (38.10mm)	6.0W @ 65°C	5.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
626-20ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	186	-	RFQ	Ficha técnica	626	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.000" (50.80mm)	6.0W @ 55°C	4.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-25ABPNE HEATSINK TO-220 W/PINS BLK 2.5" Wakefield-Vette	970	-	RFQ	Ficha técnica	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.500" (63.50mm)	6.0W @ 25°C	2.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
655-26AB HEATSINK FOR 40MM BGA Wakefield-Vette	3,946	-	RFQ	Ficha técnica	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.260" (6.60mm)	5.0W @ 60°C	3.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
677-10ABPE HEATSINK Wakefield-Vette	1,988	-	RFQ	-	677	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247, Multiwatt	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	3.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB41-303014P HEAT SINK, BGA, 30 X 30 X 10 MM, Same Sky (Formerly CUI Devices)	410	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.551" (14.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.63°C/W	Aluminum Alloy	Black Anodized
HSB39-252509P HEAT SINK, BGA, 25 X 25 X 9 MM, Same Sky (Formerly CUI Devices)	341	-	RFQ	Ficha técnica	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.354" (9.00mm)	4.3W @ 75°C	6.30°C/W @ 200 LFM	17.53°C/W	Aluminum Alloy	Black Anodized

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