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| Foto | Nº da peça do fabricante | Disponibilidade | Quantidade | Ficha técnica | Série | Embalagem | Status do produto | Tipo | Pacote resfriado | Método de fixação | Forma | Comprimento | Largura | Diâmetro | Altura da aleta | Dissipação de energia @ Aumento de temperatura | Resistência térmica @ Fluxo de ar forçado | Resistência térmica @ Natural | Material | Acabamento do material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
C126-025-1AEHEATSINK FOR TO-126 25MM |
0 |
|
Ficha técnica |
C | Box | Obsolete | Board Level, Vertical | TO-126 | Clip and PC Pin | Rectangular, Fins | 0.984" (25.00mm) | 1.280" (32.51mm) | - | 0.732" (18.60mm) | 3.5W @ 28°C | 6.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
C126-040-2VEHEATSINK FOR TO-126 40MM |
0 |
|
Ficha técnica |
C | Box | Obsolete | Board Level, Vertical | TO-126 | 2 Clips and PC Pin | Rectangular, Fins | 1.575" (40.00mm) | 1.280" (32.51mm) | - | 0.732" (18.60mm) | - | - | - | Aluminum | Degreased |
|
C126-040-2AEHEATSINK FOR TO-126 40MM |
0 |
|
Ficha técnica |
C | Box | Obsolete | Board Level, Vertical | TO-126 | 2 Clips and PC Pin | Rectangular, Fins | 1.575" (40.00mm) | 1.280" (32.51mm) | - | 0.732" (18.60mm) | - | - | - | Aluminum | Black Anodized |
|
C126-025-1VEHEATSINK FOR TO-126 25MM |
0 |
|
Ficha técnica |
C | Box | Obsolete | Board Level, Vertical | TO-126 | Clip and PC Pin | Rectangular, Fins | 0.984" (25.00mm) | 1.280" (32.51mm) | - | 0.732" (18.60mm) | 3.5W @ 28°C | 6.00°C/W @ 500 LFM | - | Aluminum | Degreased |
|
V6534BHEATSINK ALUM ANOD |
0 |
|
Ficha técnica |
- | Bulk | Obsolete | Board Level, Vertical | TO-220 | PC Pin | Rectangular, Fins | 0.787" (20.00mm) | 0.984" (25.00mm) | - | 0.394" (10.00mm) | - | - | 35.00°C/W | Aluminum | Black Anodized |
|
DHS-B9292-05AHEATSINK ASSY INTEL LGA2011 |
0 |
|
Ficha técnica |
- | Box | Obsolete | Board Level | LGA | Bolt On | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | - | 2.519" (64.00mm) | - | - | 0.17°C/W | Aluminum | - |
|
DHS-B9090-44AHEATSINK ASSY INTEL LGA1366 |
0 |
|
Ficha técnica |
- | Box | Obsolete | Board Level | LGA | Bolt On | Square | 3.543" (90.00mm) | 3.543" (90.00mm) | - | 1.004" (25.50mm) | - | - | 0.27°C/W | Aluminum | - |
|
DHS-B9292-04AHEATSINK ASSY INTEL LGA2011 |
0 |
|
Ficha técnica |
- | Box | Obsolete | Board Level | LGA | Bolt On | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | - | 1.004" (25.50mm) | - | - | 0.24°C/W | Aluminum | - |
|
XLI98C-20-20-2.15XL25 CERAMIC 20X20MM W/LI98C ADH |
0 |
|
Ficha técnica |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | 0.085" (2.15mm) | - | - | - | Ceramic | - |
|
|
XLI98C-30-30-2.15XL25 CERAMIC 30X30MM W/LI98C ADH |
0 |
|
Ficha técnica |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.085" (2.15mm) | - | - | - | Ceramic | - |
|
XLI98C-10-10-2.15XL25 CERAMIC 10X10MM W/LI98C ADH |
0 |
|
Ficha técnica |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 0.394" (10.00mm) | 0.394" (10.00mm) | - | 0.085" (2.15mm) | - | - | - | Ceramic | - |
|
|
XLI98-10-10-2.25XL25 CERAMIC 10X10MM W/LI98C ADH |
0 |
|
Ficha técnica |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 0.394" (10.00mm) | 0.394" (10.00mm) | - | 0.089" (2.25mm) | - | - | - | Ceramic | - |
|
|
XLI98-20-20-2.25XL25 CERAMIC 20X20MM W/LI98C ADH |
0 |
|
Ficha técnica |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | 0.089" (2.25mm) | - | - | - | Ceramic | - |
|
DA-T263-201ETO-263 SMD HEAT SINK ANODZD |
0 |
|
Ficha técnica |
D | Bulk | Discontinued | Top Mount | TO-263 (D²Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
DA-T268-301ETO-268 SMD HEAT SINK ANODZD |
0 |
|
Ficha técnica |
D | Bulk | Discontinued | Top Mount | TO-268 (D³Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.580" (40.13mm) | - | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Aluminum | Black Anodized |
|
DV-T263-201ETO-263 SMD HEAT SINK |
0 |
|
Ficha técnica |
D | Bulk | Discontinued | Top Mount | TO-263 (D²Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | Degreased |
|
|
DV-T268-301ETO-268 SMD HEAT SINK |
0 |
|
Ficha técnica |
D | Bulk | Discontinued | Top Mount | TO-268 (D³Pak) | Solderable Feet | Rectangular, Fins | 0.500" (12.70mm) | 1.580" (40.13mm) | - | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Aluminum | Degreased |
|
PH3-50.8-12.7-0.21-1APH3 50.8X12.07X0.21MM |
0 |
|
Ficha técnica |
PH3 | Bulk | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | Rectangular | 2.000" (50.80mm) | 0.500" (12.70mm) | - | 0.008" (0.21mm) | - | - | - | Copper | Polyester |
|
PH3-76.2-12.7-0.21-1APH3 76.2X12.07X0.21MM |
0 |
|
Ficha técnica |
PH3 | Bulk | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | Rectangular | 3.000" (76.20mm) | 0.500" (12.70mm) | - | 0.008" (0.21mm) | - | - | - | Copper | Polyester |
|
PH3-76.2-25.4-0.21-1APH3 76.2X25.4X0.21MM |
0 |
|
Ficha técnica |
PH3 | Bulk | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | Rectangular | 3.000" (76.20mm) | 1.000" (25.40mm) | - | 0.008" (0.21mm) | - | - | - | Copper | Polyester |
