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Dissipadores de Calor

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
ATS-CPX070070010-209-C1-R0

ATS-CPX070070010-209-C1-R0

HEATSINK 70X70X10MM XCUT CP

Advanced Thermal Solutions Inc.

844
RFQ
ATS-CPX070070010-209-C1-R0

Ficha técnica

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.756" (70.00mm) 2.756" (70.00mm) - 0.394" (10.00mm) - 6.26°C/W @ 100 LFM - Aluminum Blue Anodized
960-19-23-S-AB-0

960-19-23-S-AB-0

HEATSINK 19X23MM SIDE PUSH PIN

Wakefield-Vette

497
RFQ
960-19-23-S-AB-0

Ficha técnica

960 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.905" (23.00mm) - 4.80°C/W @ 200 LFM - Aluminum Black Anodized
678-39-S

678-39-S

HEATSINK TO-220/TO-247 SCREW

Wakefield-Vette

1,603
RFQ
678-39-S

Ficha técnica

678 Box Active Board Level, Vertical Assorted (BGA, LGA, CPU, ASIC...) Bolt On and Board Mounts Rectangular, Fins 2.362" (60.00mm) 0.984" (25.00mm) - 1.520" (38.61mm) - 0.60°C/W @ 600 LFM - Aluminum Black Anodized
6222BG

6222BG

BRIDGE RECTIFIER HEATSINK 0.142"

Boyd Laconia, LLC

2,028
RFQ
6222BG

Ficha técnica

- Bulk Active Board Level Bridge Rectifiers Bolt On Square, Fins 1.060" (26.92mm) 1.060" (26.92mm) - 1.250" (31.75mm) 3.0W @ 30°C 3.00°C/W @ 400 LFM 9.40°C/W Aluminum Black Anodized
ATS-FPX040040025-94-C2-R0

ATS-FPX040040025-94-C2-R0

HEATSINK 40X40X25MM R-TAB FP

Advanced Thermal Solutions Inc.

302
RFQ
ATS-FPX040040025-94-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) - 9.39°C/W @ 100 LFM - Aluminum Blue Anodized
CR201-50VE

CR201-50VE

ALUMINUM HEATSINK 50MM DEGREASED

Ohmite

118
RFQ
CR201-50VE

Ficha técnica

CR Box Active Board Level, Vertical TO-201 3 Clips and PC Pin Rectangular, Fins 1.969" (50.00mm) 2.953" (75.00mm) - - - - 3.30°C/W Aluminum Alloy Degreased
ATS-CPX040040035-186-C2-R0

ATS-CPX040040035-186-C2-R0

HEATSINK 40X40X35MM R-TAB CP

Advanced Thermal Solutions Inc.

238
RFQ
ATS-CPX040040035-186-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 1.378" (35.00mm) - 2.80°C/W @ 100 LFM - Aluminum Blue Anodized
6021BG

6021BG

HEATSINK TO-220 TABS BLACK

Boyd Laconia, LLC

3,507
RFQ
6021BG

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 30°C 5.00°C/W @ 500 LFM 12.50°C/W Aluminum Black Anodized
TGH-0450-01

TGH-0450-01

ALUMINIUM HEAT SINK 45X45MM

t-Global Technology

664
RFQ
TGH-0450-01

Ficha técnica

TGH Bulk Active Top Mount - - Square, Pin Fins 1.772" (45.00mm) 1.772" (45.00mm) - 0.394" (10.00mm) - - - Aluminum Black Anodized
7022B-MTG

7022B-MTG

HEATSINK TO-220 TAB FOLD 55.12MM

Boyd Laconia, LLC

1,552
RFQ
7022B-MTG

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.968" (49.99mm) 1.986" (50.44mm) - 0.375" (9.52mm) 10.0W @ 70°C 1.75°C/W @ 800 LFM 6.50°C/W Aluminum Black Anodized
ATS-55170K-C1-R0

ATS-55170K-C1-R0

HEAT SINK 17MM X 17MM X 14.5MM

Advanced Thermal Solutions Inc.

5,564
RFQ
ATS-55170K-C1-R0

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.571" (14.50mm) - 15.50°C/W @ 200 LFM - Aluminum Black Anodized
374724B00035G

374724B00035G

HEATSINK BGA 35X35X18MM W/ADH

Boyd Laconia, LLC

211
RFQ
374724B00035G

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.709" (18.00mm) 3.0W @ 50°C 5.20°C/W @ 200 LFM 15.30°C/W Aluminum Black Anodized
ATS-CPX060060025-132-C1-R0

ATS-CPX060060025-132-C1-R0

HEATSINK 60X60X25MM XCUT CP

Advanced Thermal Solutions Inc.

373
RFQ
ATS-CPX060060025-132-C1-R0

Ficha técnica

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.984" (25.00mm) - 2.65°C/W @ 100 LFM - Aluminum Blue Anodized
APF30-30-13CB

APF30-30-13CB

HEATSINK LOW-PROFILE FORGED

CTS Thermal Management Products

196
RFQ
APF30-30-13CB

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
960-19-33-F-AB-0

960-19-33-F-AB-0

HEATSINK 19X33MM FRONT PUSH PIN

Wakefield-Vette

265
RFQ
960-19-33-F-AB-0

Ficha técnica

960 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 1.299" (33.00mm) - - - Aluminum Black Anodized
TGH-0522-01

TGH-0522-01

ALUMINIUM HEAT SINK 52.2X52.2MM

t-Global Technology

989
RFQ
TGH-0522-01

Ficha técnica

TGH Bulk Active Top Mount - - Square, Fins 2.055" (52.20mm) 2.055" (52.20mm) - 0.905" (23.00mm) - - - Aluminum -
533002B02551G

533002B02551G

HEATSINK TO-220 SOLDERPIN/CLIP

Boyd Laconia, LLC

1,438
RFQ
533002B02551G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
902-21-2-12-2-B-0

902-21-2-12-2-B-0

HEATSINK 21X21X12MM PIN

Wakefield-Vette

5,631
RFQ
902-21-2-12-2-B-0

Ficha técnica

902 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.457" (11.60mm) - 5.80°C/W @ 200 LFM 14.30°C/W Aluminum Black Anodized
534202B03453G

534202B03453G

BOARD LEVEL HEATSINK .5" TO-220

Boyd Laconia, LLC

659
RFQ
534202B03453G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.40°C/W Aluminum Black Anodized
371824B00032G

371824B00032G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

351
RFQ
371824B00032G

Ficha técnica

- Tray Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.275" (7.00mm) 1.5W @ 50°C 9.70°C/W @ 200 LFM 31.90°C/W Aluminum Black Anodized
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