Por favor, contacte-nos para obter os preços mais recentes e a quantidade disponível.

Dissipadores de Calor

Foto Nº da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Série Embalagem Status do produto Tipo Pacote resfriado Método de fixação Forma Comprimento Largura Diâmetro Altura da aleta Dissipação de energia @ Aumento de temperatura Resistência térmica @ Fluxo de ar forçado Resistência térmica @ Natural Material Acabamento do material
530613B00000G

530613B00000G

HEATSINK TO-220 BLACK 1.18"

Boyd Laconia, LLC

206
RFQ
530613B00000G

Ficha técnica

- Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 80°C 6.00°C/W @ 600 LFM 16.70°C/W Aluminum Black Anodized
UPTO3CB

UPTO3CB

HEATSINK PWR MED-HI BLACK TO-3

CTS Thermal Management Products

685
RFQ
UPTO3CB

Ficha técnica

- Box Active Board Level TO-3 Bolt On Square, Pin Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.000" (25.40mm) - - 9.00°C/W Aluminum Black Anodized
APF19-19-10CB

APF19-19-10CB

HEATSINK LOW-PROFILE FORGED

CTS Thermal Management Products

23,859
RFQ
APF19-19-10CB

Ficha técnica

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS012012010-SF-2I

ATS012012010-SF-2I

HEATSINK 12X12X10MM

Advanced Thermal Solutions Inc.

114
RFQ
ATS012012010-SF-2I

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.472" (12.00mm) 0.472" (12.00mm) - 0.394" (10.00mm) - 23.70°C/W @ 200 LFM - Aluminum Black Anodized
326005B00000G

326005B00000G

HEATSINK TO-5 1W H=.375" BLK

Boyd Laconia, LLC

1,363
RFQ
326005B00000G

Ficha técnica

- Bag Active Board Level TO-5 Press Fit Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Aluminum Black Anodized
574502B03700G

574502B03700G

HEATSINK TO220 VER MNT W/TAB.75"

Boyd Laconia, LLC

1,895
RFQ
574502B03700G

Ficha técnica

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
ATS-CPX040040025-116-C2-R0

ATS-CPX040040025-116-C2-R0

HEATSINK 40X40X25MM XCUT CP

Advanced Thermal Solutions Inc.

1,143
RFQ
ATS-CPX040040025-116-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) - 4.14°C/W @ 100 LFM - Aluminum Blue Anodized
ATS-FPS058037011-32-C1-R0

ATS-FPS058037011-32-C1-R0

HEATSINK 57.9X36.83X11.43MM FP

Advanced Thermal Solutions Inc.

276
RFQ
ATS-FPS058037011-32-C1-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 1.450" (36.83mm) - 0.450" (11.43mm) - 21.45°C/W @ 100 LFM - Aluminum Blue Anodized
TGH-0400-03

TGH-0400-03

ALUMINIUM HEAT SINK 40X40MM

t-Global Technology

809
RFQ
TGH-0400-03

Ficha técnica

TGH Bulk Active Top Mount - - Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.433" (11.00mm) - - - Aluminum Black Anodized
505403B00000G

505403B00000G

HEATSINK TO-3 H31.75MM

Boyd Laconia, LLC

3,143
RFQ
505403B00000G

Ficha técnica

- Bulk Active Board Level TO-3 Bolt On Square, Pin Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.250" (31.75mm) 7.0W @ 40°C 1.50°C/W @ 600 LFM 6.00°C/W Aluminum Black Anodized
ATS-CPX025025010-137-C2-R0

ATS-CPX025025010-137-C2-R0

HEATSINK 25X25X10MM L-TAB CP

Advanced Thermal Solutions Inc.

849
RFQ
ATS-CPX025025010-137-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) - 18.36°C/W @ 100 LFM - Aluminum Blue Anodized
523002B00000G

523002B00000G

HEATSINK TO-220 W/TAB BLACK

Boyd Laconia, LLC

3,465
RFQ
523002B00000G

Ficha técnica

- Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.60°C/W Aluminum Black Anodized
ATS-CPX050050025-124-C2-R0

ATS-CPX050050025-124-C2-R0

HEATSINK 50X50X25MM XCUT CP

Advanced Thermal Solutions Inc.

2,455
RFQ
ATS-CPX050050025-124-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.984" (25.00mm) - 3.18°C/W @ 100 LFM - Aluminum Blue Anodized
7-345-2PP-BA

7-345-2PP-BA

HEATSINK PWR DUAL BLACK TO-220

CTS Thermal Management Products

1,067
RFQ
7-345-2PP-BA

Ficha técnica

7 Box Active Board Level TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 2.000" (50.80mm) - 0.553" (14.05mm) 6.0W @ 25°C - 4.70°C/W Aluminum Black Anodized
BDN11-3CB/A01

BDN11-3CB/A01

HEATSINK CPU W/ADHESIVE 1.11"SQ

CTS Thermal Management Products

878
RFQ
BDN11-3CB/A01

Ficha técnica

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.110" (28.19mm) 1.110" (28.19mm) - 0.355" (9.02mm) - 7.20°C/W @ 400 LFM 20.90°C/W Aluminum Black Anodized
ATS-CPX040040025-116-C1-R0

ATS-CPX040040025-116-C1-R0

HEATSINK 40X40X25MM XCUT CP

Advanced Thermal Solutions Inc.

510
RFQ
ATS-CPX040040025-116-C1-R0

Ficha técnica

pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) - 4.11°C/W @ 100 LFM - Aluminum Blue Anodized
567-24AB

567-24AB

1/8 BRICK HEATSINK 55X20.7X6.1MM

Wakefield-Vette

129
RFQ
567-24AB

Ficha técnica

567 Tray Active Top Mount Eighth Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.165" (55.00mm) 0.815" (20.70mm) - 0.240" (6.10mm) - 7.20°C/W @ 300 LFM 7.20°C/W - Unfinished
567-45AB

567-45AB

1/8 BRICK HEATSINK 55X20.7X11.4M

Wakefield-Vette

599
RFQ
567-45AB

Ficha técnica

567 Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.165" (55.00mm) 0.815" (20.70mm) - 0.449" (11.40mm) - 4.30°C/W @ 300 LFM 4.30°C/W - Unfinished
374424B00035G

374424B00035G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

1,162
RFQ
374424B00035G

Ficha técnica

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) 4.0W @ 80°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
ATS-CPX025025020-139-C2-R0

ATS-CPX025025020-139-C2-R0

HEATSINK 25X25X20MM L-TAB CP

Advanced Thermal Solutions Inc.

1,981
RFQ
ATS-CPX025025020-139-C2-R0

Ficha técnica

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.790" (20.00mm) - 9.10°C/W @ 100 LFM - Aluminum Blue Anodized
Total 122183 Record«Prev1... 1617181920212223...6110Next»

Comece agora!

Obtenha as últimas notícias

EASTECH Electronics

Início

EASTECH Electronics

Pesquisar

EASTECH Electronics

Produtos

EASTECH Electronics

Whatsapp

Enviando...
×
Enviado com sucesso!
Obrigado pelo seu envio, nossa equipe de vendas receberá sua solicitação e entraremos em contato dentro de 12 horas com uma cotação.
OK